Special Report
Building Faster Chips
First of two parts: What used to be a straightforward challenge is now much more complex.
Top Stories
200mm Equipment Shortfall
Older equipment is now very much in demand due to shifts in end markets and new options for packaging.
To 7nm And Beyond
GlobalFoundries’ top technologists open up on next-gen FD-SOI, the economics and challenges of 7nm, and what lies ahead.
Stacking Logic On Logic
CEA-LETI’s approach is proven to work using existing process technology, but challenges remain.
Blogs
Editor In Chief Ed Sperling observes that paranoia about IP theft is shifting from the leading edge to the middle market, in Roots Of Distrust Spread.
Executive Editor Mark LaPedus examines the hottest topics facing the manufacturing equipment industry, in 5 Takeaways From Semicon.
Applied Materials’ Er-Xuan Ping looks at future memory types and how we will get there, in Material And Process Challenges In A Changing Memory Landscape.
Mentor Graphics’ David Abercrombie walks through the options and potential pitfalls of advanced patterning in a step-by-step video of Colorless Vs. Colored Double-Patterning Design Flows.
Coventor’s Joseph Ervin digs into the impact of pattern dependence on etch, deposition and CMP processes, in Pattern Dependence Process Modeling.
Semico Research’s Adrienne Downey finds an expanded role for 3D printing in PCB manufacturing and keeping equipment running longer, in 3D Printing: What Does It Mean For The Semiconductor Industry?
SEMI’s Clark Tseng examines why capacity surpassed memory capacity last year, in Foundry Capacity Investment Led By Taiwan And China.
