Special Report
The Rise Of Thin Wafer Processing
From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer processes.
Top Stories
What Exactly Are Chiplets And Heterogeneous Integration?
New technologies drive new terminology, but the early days for those new approaches can be very confusing.
Many Options For EUV Photoresists, No Clear Winner
Chip industry searching for optimal balance of sensitivity, resolution, and LWR at leading-edge nodes.
Challenges Grow For Medical ICs
Making devices that are defect-free and able to withstand years of harsh environments is made more difficult by a combination of low volume and high complexity.
Sponsor Blogs
Amkor’s Chin Joo Tan outlines a process that coats die and wire-bonded lead frames in an adhesion promoter to help ensure long-term reliability and performance, in Eliminating Interfacial Delamination in High-Power Automotive Devices.
Synopsys’ Saurabh Suryavanshi shows how to create synthetic data to train AI models that enable engineers to perform virtual fab runs, in TCAD-Based AI Models For Modern Fab Workflows.
Lam Research’s Daebin Yim explores a way to mitigate gate-induced drain leakage by dividing the gate into sections with different electrical properties, in Improving DRAM Performance Using Dual Work-Function Metal Gate (DWMG) Structure.
eBeam Initiative member Harry Levinson finds that high-NA EUV is making progress toward high-volume manufacturing while optical lithography is seeing continued advances, in Reflecting On The SPIE Advanced Lithography + Patterning Symposium 2025.
Promex’s Dick Otte contends that glass substrates offer a valuable alternative for specific applications, even if they do not replace epoxy entirely, in Using Glass As A Dielectric In Electronic Packaging.
Brewer Science’s Jessica Albright looks at PFAS used in the semiconductor industry and efforts to eliminate them from the supply chain, in Four Things Every Engineer Should Know About PFAS.
ASE’s Mike Hung explains why active interposers with transistors will gradually replace passive interposers, driving the transition to vertical stacking, in AI And Semiconductor In Reciprocity.
SEMI’s Pushkar Apte and Melissa Grupen-Shemansky, and IBM’s Jim Sexton, investigate ways to unlock the full potential of AI, from algorithms and architecture to foundational silicon technologies, in Sustainable AI Systems For Energy-Efficient Computing.
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