Top Stories
Cooling Chips Still A Top Challenge
Heat pipes, lids, thermal interfaces, and micro-channel cooling help remove the heat generated by chips.
Mask Complexity, Cost, And Change
Evolving lithography demands are challenging mask writing technology; shift to curvilinear is underway.
Advanced Packaging Depends On Materials And Co-Design
New materials play a pivotal role, but solving integration problems remains a challenge.
Sponsor Blogs
Amkor’s Tsung Ting Lee finds that when the via impedance value cannot be determined, evaluating the signal transmission can provide a viable alternative, in Maximizing Signal Integrity: Fine-Tuning Via Impedance In HDFO Architectures.
Synopsys’ Anders Blom explains how to quickly screen large amounts of possible materials for specific properties and select promising candidates for deeper analysis, in Revolutionizing Semiconductor Development With GPU-Enhanced Atomistic Modeling.
Lam Research’s Timothy Yang examines optimal conditions for removing areas of the line and space resist pattern after EUV exposure, in Laser-Focused Results: Improving EUV Line Edge Roughness With Ion Beam Etching.
SEMI’s Pushkar Apte shows how the switch to transformer models has increased AI-driven computing demand by a factor of 50 million over 5 years, in Energy-Efficient Computing Systems For Sustainable AI.
Sponsor White Papers
Molybdenum: Transforming Semiconductor Manufacturing For Next-Generation Technologies
How advanced metallization — specifically molybdenum — is becoming a critical enabler for semiconductor manufacturing.
New Package Solutions for Automotive Optical Sensors
New optical ball grid array (OBGA) packaging platform for automotive applications.
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