Top Stories

Next-Gen Memory Ramping Up
At least 5 technologies are in the running, with 3D XPoint leading the pack.

Inspecting Unpatterned Wafers
Finding smaller defects earlier is becoming more difficult and expensive.

Big Shifts In Tech Conferences
New technologies and trends have created an explosion of shows; some attempt to go broad, others narrow and deep, with plenty of confusion all around.

Blogs

Editor in Chief Ed Sperling argues that import/export duties are only part of the picture, and what you can’t see can still hurt, in The Hidden Cost Of Tariffs.

Executive Editor Mark LaPedus shines a spotlight on 3D memory, FeFETs, MRAM and ReRAM, in Memory Startups To Watch.

GlobalFoundries’ Peter Rabbeni contends that 5G is necessary to deal with an increasing volume of data, but notes that millimeter wave will require a wave of new technologies, in Optimizing 5G With AI At The Edge.

Semico Research’s Jim Feldhan predicts that by 2023 more than 90% of vehicles produced will be connected, adding a range of features, in Automotive Electronics: Driving The Semiconductor Market.

Lam Research’s Kris Kendall notes that the cost contribution of electronics in new cars has reached 45%, in Semiconductors In Automotive.

SEMI blogger Julian West observes that the number of vacuum process steps will increase with multi-patterning and 3D NAND, in Growth Ahead For Vacuum Subsystems.

Applied Materials’ Jonathan Bakke looks at what comes after tungsten fill for contacts and copper for the lowest-level interconnects, in The Materials Side Of AI.

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