Special Report
Intel Vs. Samsung Vs. TSMC
Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.
Key Technologies To Extend EUV To 14 Angstroms
Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.
Top Stories
Legacy Process Nodes Going Strong
The critical, and growing, significance of mature node chips and processes.
Precision Patterning Options Emerge For Advanced Packaging
Photolithography is still mainstream, but innovative new solutions are coming.
New Interconnect Metals Need New Dielectrics
Options emerge for thin films that are viable at the most advanced nodes.
Blogs
Lam Research’s QingPeng Wang discusses the optimal way to perform deposition/etch cycling and improve critical dimension uniformity, in Improving Line Edge Roughness Using Virtual Fabrication.
Amkor’s Heejun Jang shows how an extended platform of 2.5D Si interposer can break through the limitations of the large Si interposer fabrication, in Reliability Performance Of S-Connect Module (Bridge Technology) For Heterogeneous Integration Packaging.
Synopsys’ Wolfgang Demmerle explains why using contours is an effective way to extract all information within a SEM image’s FOV, in Metrology Analysis Tool For Photolithography Process Characterization At Advanced Nodes.
D2S/eBeam Initiative’s Asmus Hetzel talks about key trends at EMLC, including curvilinear design, AI in inspection, and multi-beam mask writers, in European Mask And Lithography Conference 2024 Worth Attending.
SEMI’s Krish Raghunath notes that wrap-around services, such as childcare and transportation, can help get under-represented communities into industry careers, in Building A Sustainable And Diverse Semiconductor Workforce: Insights From ASMC 2024 Panel Discussion.
Sponsor White Papers
CD Spec For Curvilinear Masks
Proposed curvilinear mask equivalent CD specification.
Multi-Tier Die Stacking Through Collective Die-To-Wafer Hybrid Bonding
The proposed imec collective-die-to-wafer bonding flow, including laser debonding with laser release layer and acoustic layer, can be extended to the multi-tier level.
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