Top Stories
Big Shifts In Power Electronics Packaging
Packages are becoming more complex to endure high power and high temperatures across a variety of applications.
IC Manufacturing Targets Less Water, Less Waste
New technologies and processes help companies strive for net-zero.
Increasing AI Energy Efficiency With Compute In Memory
How to process zettascale workloads and stay within a fixed power budget.
What Can Go Wrong In Heterogeneous Integration
Workflows and tools are disconnected, mechanical stress is ill-defined, and complete co-planarity is nearly impossible. But there are solutions on the horizon.
Making Heterogeneous Integration More Predictable
Engineering teams, methods, and modeling need to be rethought. One size doesn’t fit all, and defects are inevitable.
Blogs
Amkor’s Gabriel Chang and Ricky Zang examine methods for predicting laser-assisted bonding parameters and ideal solder temperature range for a black box substrate, in LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation.
Synopsys’ Shela Aboud zeroes in on using simulations with physics-based models to develop and optimize semiconductor device technology, in What Is TCAD And Why It Is Essential For The Semiconductor Industry.
eBeam Initiative’s Jan Willis shows how digital twins can bridge the data gap that keeps deep learning prototypes from moving to production, in Center For Deep Learning In Electronics Manufacturing: Bringing Deep Learning To Production For Photomask Manufacturing.
Lam Research’s Daebin Yim lays out a technique for benchmarking the performance of ruthenium, cobalt, and copper in a damascene vehicle with varying critical dimensions, in Analysis Of BEOL Metal Schemes By Process Modeling.
Tignis’ David Park offers a way to help teams be more efficient through expedited onboarding and predictive maintenance, in Transforming Semiconductor Manufacturing: How AI And ML Boost Productivity And Beat The Skill Shortage.
University of Florida’s Toshi Nishida, University of Virginia’s Avik W. Ghosh and Mircea Stan, and University of Central Florida’s Swaminathan Rajaraman explain why across-the-stack innovation, from new materials and devices to novel computing models, is now required, in Maximizing Edge Intelligence Requires More Than Computing.
Sponsor White Papers
Curvilinear Mask Patterning For Maximizing Lithography Entitlement
Practical solutions to overcome the computational challenges associated with this technique, as well as the difficulties of manufacturing curvilinear masks.
Newsletter Signup
Find our email newsletter signup page here.
