Top Stories

MIS Packaging Takes Off
Molded interconnect substrate emerges as packaging choice for analog, power ICs and cryptocurrency chips.

Software-Defined Test And Measurement
SDx is making inroads into 5G, automotive radar, and other new technology.

Packaging Chips For Cars
Why packaging is becoming increasingly critical and difficult in the automotive market.

Blogs

Editor In Chief Ed Sperling contends that time-to-market concerns and growing design costs are forcing broad changes, in The Case For Chiplets.

Technology Editor Jeff Dorsch looks at what’s ahead this month, in NIWeek On Offer In May.

Brewer Science’s Reuben Chacko digs into a different way to improve process reliability and speed up time to deployment, in Surface Modification: Solving Semiconductor Manufacturing Challenges.

National Instruments’ Bhavesh Mistry extols the value of student-centered instruction over an extended period of time, in Toward Project-Based Learning.

Sponsor White Papers

How Power, Lighting, And EVS Improve Rotorcraft Safety And Performance
Power systems need to be flexible, configurable and scalable.

Understanding NI CompactRIO Scan Mode
Use cases, operation and architecture for technology that can reduce development time and complexity.

Package Designers Need Assembly-Level LVS For HDAP Verification
Unique package connectivity issues require LVS-like techniques that can move across the entire package.