Special Report
EDA’s Top Execs Map Out An AI-Driven Future
AI is accelerating the need for 3D-ICs and digital twins, and causing lots of disruption along the way.
Top Stories
Mixed Messages Complicate Mixed-Signal
Analog and mixed signal content is adding risk to ASIC designs. Pessimists see the problem getting worse, while optimists point to AI and chiplets for relief.
Distributing Intelligence Inside Multi-Die Assemblies
Disaggregration requires traffic cops and in-chip monitors to function as expected over time.
Security Vulnerabilities Difficult To Detect In Verification Flow
New tools and techniques are being developed and can help keep the verification process secure, alongside a firm foundation of good design verification practices.
Can You Build A Known-Good Multi-Die System?
Executive Outlook: Just because the various components in an advanced package work individually and together doesn’t guarantee they will work post-assembly.
Video
Agentic AI In Chip Design
What comes next after generative AI, and how that will be used in EDA.
Opinion
Iteration And Hallucination
For many aspects of an EDA flow, hallucinations from AI are not really that serious because that is no worse than engineers on a Friday afternoon.
Sponsor Blogs
Cadence’s Moshiko Emmer talks about how ensuring trusted execution across multiple chiplets and vendors is more complex than in traditional monolithic SoCs, in Redefining SoC Design: The Shift To Secure Chiplet-Based Architectures.
Alphawave Semi’s Tony Chan Carusone explains how FPGAs can be used to identify bursts of errors in wireline networking and communications that otherwise would be missed, in Programmable Hardware Delivers 10,000X Improvement In Verification Speed Over Software For Forward Error Correction.
Sponsor White Papers
3D Packaging vs 3D Integration eBook
The intricacies of multi-die packages and the design and analysis hurdles inherent in advanced package design.
Design and Test Solutions for E-Mobility and Autonomous Driving
Creating high-quality and high-performance autonomous and connected vehicles while mitigating safety risks across their entire lifecycle.
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