Top Stories

Better Analytics Needed For Assembly
Many defects occur after manufacturing, but not all of them are being caught.

5G Brings New Testing Challenges
Millimeter-wave and beamforming capabilities present the biggest testing challenges.

Auto Chip Reliability Opens Door To Other Industries
Chips finding traction in aerospace, industrial, and even consumer applications.

Blogs

Editor in Chief Ed Sperling contends that making automotive chips more reliable may be the easy part, in The Very Long Road To Autonomous Vehicles.

proteanTecs’ Yuval Bonen demonstrates how to shift from preventive to predictive maintenance to manage downtime and avoid service outages, in Fleet Management Of Data Center Electronics.

FormFactor’s David Viera examines how specifications associated with 5G devices are driving wafer test requirements, in Considerations For 5G Production Test.

yieldHUB’s Marie Ryan explains when to add new features to software without detracting from core functions, in Customer Input Guides Tool Development.

Sponsor White Papers

In-field In-Mission Reliability Monitoring Based On Deep Data
A Deep Data approach to reliability monitoring in advanced electronics, based on degradation as a precursor for failure.

Advanced Packaging, Heterogeneous Integration And Test
Die-integration technologies are revolutionizing packaging, assembly, and test.

Case Study – Socket Metrology
Optimizing a customer’s backend inspection and socket metrology cutting cost and increasing yields for high-volume manufacturing.