Top Stories

Using Test And Metrology Data For Dynamic Process Control
Fine-tuning process control is imperative for advanced packaging, but ongoing challenges can impact yield and quality.

Screening For Known Good Interposers
Increasing interconnect density is making it harder to guarantee these devices will work as expected.

DFT At The Leading Edge
Rising complexity and heterogeneous integration are reshaping test methodologies and fault coverage, but challenges persist.

Shortcutting Graduates’ Path To Productivity In Manufacturing And Test
Semiconductor companies are working with universities to custom-build engineering curricula so new hires can hit the ground running.

Sponsor Blogs

Onto Innovation’s Keith Best looks at the feasibility of organic and glass substrates in light of ever-shrinking line/space requirements, in Innovations Driving The Advanced Packaging Roadmap: Part One.

PDF Solutions’ John Kibarian explains why increasing engineering efficiency will require lowering the AI expertise barriers for everyone in the chip industry, in Semiconductor Manufacturing’s Transformational Challenges.

Teradyne’s Jeorge Hurtarte digs into standards that are paving the way for more efficient, reliable, and collaborative semiconductor testing processes based on access to real-time test data, in Industry Standards For Chiplets And Their Role In Test.

proteanTecs’ Ziv Paz explores a standardized approach to gathering critical data on system health, enabling designers to fine-tune performance and prevent failures, in Expanding The Horizon Of System Monitoring With The Arm SMCF.

Advantest’s Ken Butler shows how accurately modeling DPPM allows engineers to make decisions that affect the tradeoffs between test effort and product quality, in Experiences Estimating Test Quality And Test Escape Rates.

Siemens’ Peter Orlando examines a bus-based scan distribution architecture that provides a scalable method for concurrently testing identical and non-identical cores, in No-Compromise Packetized Test Improves DFT Efforts.

Sponsor White Papers

Cut Defects, Not Yield
Outlier detection with ML precision.

Streaming Scan Network
No-compromise packetized test.

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