Top Stories
DTCO/STCO Create Path For Faster Yield Ramps
A holistic approach can improve reliability and reduce defects, but it has to start early in the design cycle.
AI/ML Challenges In Test and Metrology
New tools are changing the game, but it will take time and collaboration for them to achieve their full potential.
Strategies For Detecting Sources Of Silent Data Corruption
Manufacturing screening needs improvement, but that won’t solve all problems. SDCs will require tools and methodologies that are much broader and deeper.
Videos
Cost And Quality Of Chiplets
Why adaptive test is becoming necessary in heterogeneous designs.
Blogs
Onto Innovation’s Nick Keller details a non-destructive solution for measuring repeating metals in a multi-layer stack, in Using Picosecond Ultrasonics To Measure Trench Structures In SiC Power Devices.
Synopsys’ Jyotika Athavale digs into why reliability, availability, and serviceability (RAS) expectations are growing and targets are continuing to get more stringent, in Silent Data Corruption Considerations For Advanced Node Designs.
NI’s Alejandro Escobar Calderon explains how a non-terrestrial network structure goes beyond conventional limits, utilizing satellite and aerial platforms that can provide seamless connectivity worldwide, in Reaching For The Stars: Embracing Non-Terrestrial Networks In The Age Of 5G And Beyond.
Nordson’s Chris Rand shows how various inspection technologies complement each other, such as the use of both acoustic and X-ray inspection, or 2D X-ray imaging and 3D inspection, in X-Ray Inspection In The Semiconductor Industry.
Bruker Optics’ Inga Koehler notes that choosing the correct wavelength for an application depends on factors like resonance, fluorescence, and sample absorption, in Laser Wavelength Selection In Raman.
proteanTecs’ Noam Brousard delves into the intricacies of power consumption by exploring the economics of CPUs, GPUs, and AI accelerators, in Examining The Impact Of Chip Power Reduction On Data Center Economics.
Sponsor White Papers
Overcoming The Challenges Of Verifying Multi-Die Systems
A guide for verifying multi-die systems.
MIMO Application Framework
How researchers can build Massive MIMO testbeds to rapidly prototype large-scale antenna systems.
Application-Specific Power Performance Optimizer Based On Chip Telemetry
A closed-loop hardware-firmware application for reliability and functional-workload aware adaptive voltage scaling (AVS).
Newsletter Signup
Find our email newsletter signup page here.
