Top Stories
Die-To-Die Stress Becomes A Major Issue
Advanced nodes and packaging are turning minor issues into major ones.
More Data, More Memory-Scaling Problems
Challenges persist for DRAM, flash, and new memories.
Verification’s Inflection Point
What will the future of verification look like? New demands being placed on verification teams are causing the industry to take a deep look at the possibilities.
Blogs
Siemens’ John Parry and Wendy Luiten explain why it’s important to use both simulation and testing to improve reliability and productivity in digital designs, in Achieving Physical Reliability Of Electronics With Digital Design.
Rambus’ John Eble lays out what to expect from the next generation of server memory, in Five Key Changes Coming With DDR5 DIMMs.
Arm’s Rob Aitken describes efficiency gains that can be boosted by combining CPUs, NPUs, GPUs, and networking processors in novel ways, in Is Computing Facing An Energy Crisis?
Synopsys’ Priyank Shukla details the latest architectural shift has significant implications for simulation and modeling of high-speed SerDes transceivers, in 112G SerDes Modeling And Integration Considerations.
Cadence’s Paul McLellan shines a light on the path forward for EUV and the new transistor types needed to reach 1nm, in Imec’s Plan For Continued Scaling.
Ansys’ Theresa Duncan and Craig Hillman untangle a new standard for reliability physics analysis of electrical, electronic, and electromechanical components, in Improving Automotive Electronic Hardware With SAE J3168.
