Special Report
Rethinking The Cloud
As the volume of data increases exponentially, companies are changing their approach to where data gets processed, what gets moved, and focusing on the total price for moving and storing that data.
Top Stories
Thermal Is Still Simmering
While thermal is a more pressing concern than ever, uptake by engineering teams has yet to pick up steam.
The Interconnected Web Of Power
Why is power estimation so hard? Until it can be estimated accurately enough it is difficult to control, and that means continued over-design.
Automotive Drives Novel IP Demands
Once a market for a previous generation of technology, the automotive market is now filled with sophisticated and very creative designs.
Antennas Everywhere
As more devices are equipped with communications capabilities, the number of antennas will explode. That creates new challenges on every level.
One-To-Many: Shifting Left, Adding Gears
In this year’s DVCon Keynote, Aart DeGeus talked about the ways in which many technologies collaborate to bring about success and continue our exponential growth.
Blogs
Editor in Chief Ed Sperling contends that without a comprehensive data management policy, improvements in technology will be meaningless, in Dark Data.
Executive Editor Ann Steffora Mutschler questions which came first, the technology or the push by the auto industry, in Where Did Auto Innovation Begin?
Mentor’s Mick Tegethoff and David Lee dig into high-performance analog and RF circuits, where designers are facing quantitative and qualitative challenges that didn’t exist a few years ago, in Modeling High-Performance Analog And RF Circuits In Nanometer-Scale CMOS.
Synopsys’ Alan Gibbons observes that virtual prototyping with UPF 3.0-based IP power models can create a comprehensive mechanism for early detection and correction of system power management issues, in Extending UPF For Use In System-Level Design.
Cadence’s Brian Fuller looks at what object-based audio means for system design, in With Object-Based Audio, Dizzying Design Possibilities.
Atrenta’s Ravindra Aneja argues that if functional CDC issues haven’t stalled your designs yet, you’ve been lucky, and they probably will in the future, in Clock Domain Crossing: Are We There Yet?
Ansys’ Chris Ortiz explains that power integrity requires accurate modeling of voltage variation across die and efficient coupling between chip/package layouts, in Package Modeling Needs For A Robust IC Power Integrity Sign-Off.
