Special Report
SRAM Scaling Issues, And What Comes Next
While it will remain a workhorse memory, using SRAM at advanced nodes requires new approaches.
Top Stories
AI Tradeoffs At The Edge
The best ways to optimize AI efficiency today, and other options under development.
Re-architecting Hardware For Energy
The industry is at a turning point. Power has been a second-class citizen when it comes to optimization, but thermal is becoming the great limiter for what will be possible in the future.
Round Tables
Memory’s Future Hinges On Reliability
Robust implementations are a major issue, particularly as memory density increases.
Video
New Issues In Power Semiconductors
Challenges increase with higher voltage and heterogeneous integration in advanced packages.
Blogs
Rambus’ Lou Ternullo looks at why performance demands of generative AI and other advanced workloads will require new architectural solutions enabled by CXL, in Building Scalable And Efficient Data Centers With CXL.
Ansys’ Raha Vafaei shines a light on how the evolution of photonics engineering will encompass novel materials and cutting-edge techniques, in Photonics: Harnessing The Power of Light.
Siemens’ Keith Felton explains why embracing emerging approaches is essential for crafting IC packages that address the evolving demands of sustainability, technology, and consumer preferences, in The Seven Pillars Of IC Package Physical Design.
Cadence’s Mark Seymour lays out how CFD simulation software can predict time-dependent aspects and various failure scenarios for data center managers, in Expecting The Unexpected: Analyzing A Data Center Cooling Failure.
ARM’s Adnan Al-Sinan and Gian Marco Iodice point out that LLMs already run well on small devices, and that will only improve as models become smaller and more sophisticated, in Generative AI On Mobile Is Running On The Arm CPU.
Keysight’s Roberto Piacentini Filho shows how a modular approach can improve yield, reduce cost, and improve PPA/C, in What Is A Chiplet, And Why Should You Care?
Quadric’s Steve Roddy finds that smart local memory in an AI/ML subsystem solves SoC bottlenecks, in Thanks For The Memories!
Synopsys’ Ian Land, Kenneth Larsen, and Rob Aitken detail why the traditional approach using monolithic system-on-chips (SoCs) falls short when addressing the complex needs of modern systems, in Impact Of 3DHI On Aerospace And Government Applications.
Sponsor White Papers
IC Package Physical Design Best Practices
What’s needed to design the latest heterogeneous designs using HBM and chiplets.
An Empirical Comparison Of Optimizers For Quantum Machine Learning With SPSA-Based Gradients
A new approach to the gradient-free optimizer uses the approximated gradient from SPSA in combination with state-of-the-art gradient-based classical optimizers.
How To Build Computer Vision Solutions
See the future of IoT.
Fluid Kinematics Using Ansys Fluent
Learn about fluid kinematics.
Early Architecture Performance And Power Analysis Of Multi-Die Systems
The challenges and benefits of multi-die systems.
Sigrity X — Redefining Signal And Power Integrity
Streamline setup time for detailed system-level SI/PI analysis by transitioning seamlessly across different analysis workflows.
Private Delegated Computations Using Strong Isolation
A new solution for confidential computing demonstrated on private in-cloud object detection on encrypted video streaming from a video camera.
Newsletter Signup
Find our email newsletter signup page here.
