Top Stories
Programming Processors In Heterogeneous Architectures
Optimizing PPA for different processor types requires very different approaches, and all of them are now included in the same design.
Power/Performance Costs Of Securing Systems
Security requires significant overhead, but it is no longer an option to ignore it. Cybercriminals will continue to exploit weak components.
EDA’s Role Grows For Preventing And Identifying Failures
Finding root causes of problems shifts left, fueled by better data and improvements in tools.
Video
Changes In Memory Design
Customization, reliability, and much more data are altering how memory is developed and used.
Blogs
Quadric’s Jon Bunting shows how transformers have inspired a flurry of investment and research, producing some of the most impactful model architectures and AI products to-date, in (Vision) Transformers: Rise of the Chimera.
Cadence’s Dharini SubashChandran and Manoj Kachadiya examine how flash’s varying degrees of speed, density, and performance cater to different application requirements, in Exploring The World Of Flash Memory: Serial, Dual, Quad, And Octal Interface.
Rambus’ Vinitha Seevaratnam traces the evolution of data rates in mobile-focused memory, in LPDDR5X: High Bandwidth, Power Efficient Performance For Mobile & Beyond.
Fraunhofer IIS EAS’ Kay-Uwe Giering and Christian Skubich point to a new level of temporal precision, in Fast Time-To-Digital Converters As Ultra-Precise Stopwatches For Quantum Technologies.
Synopsys’ Vamsi Thatha shows how to predict metal fill effects while performing RC extraction, in Using Virtual Metal Fill To Solve Real Design Problems.
Siemens’ Wilfried Wessel lays out the key factors that determine module efficiency and performance, in How To Answer Five Common Questions About Power Module Current Density.
Ansys’ David Dang digs into virtual validation, a technique that helps ensure electronics can withstand harsh in-vehicle environments, in 4 Ways To Design More Reliable Automotive Electronics.
Arm’s Neil Parris highlights the ability to experiment and access to technical support help as a way to overcome early challenges, in How To Address The Top 5 Silicon Startup Challenges.
Sponsor White Papers
Power Modules: A Four-Dimensional Design Challenge Calls For A Holistic Design And Verification Approach
Typical design issues for power semiconductors.
ESD Co-Design For High-Speed SerDeS In FinFET Technologies
The problem in current finFET technologies with classical protection methods, and circuit topology and layout checks to verify ESD robust architectures and correct implementation.
Cold Plate Technology Comparison
Comparing thermal transfer capabilities of two cold plate technologies and translating that info into an analysis of both random failure and integrated circuit (IC) wear-out reliability.
Uncovering Instabilities In Variational-Quantum Deep Q-Networks
How variational quantum deep Q-networks (VQ-DQN) are subject to instabilities that cause the learned policy to diverge.
Arm SystemReady Certification System Requirements Specification V2.1
This specification describes the requirements for the Arm SystemReady program.
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