Special Report
When To Expect Domain-Specific AI Chips
With the intended application evolving faster than silicon can be developed, optimizing hardware becomes a delicate balance.
Top Stories
Temperature: A Growing Concern For Chip Security Experts
It’s still a lab-based threat, but heat is emerging as a new attack vector.
New Approaches Needed For Power Management
Limited power budgets, thermal issues, and increased demand to process more data faster are driving some novel solutions.
IC Industry’s Growing Role In Sustainability
Addressing energy consumption has become a requirement as AI takes root, but it requires changes across the entire ecosystem.
Blogs
Synopsys’ Keivan Javadi Khasraghi and Ruben Sousa explain why PCIe will continue to be a key player for high-speed interconnects, especially in data centers, in Why PCIe 7.0 Over Optics.
Fraunhofer IIS/EAS’ André Schneider and Martin Lehmann dig into industrial sensors and how innovative strategies can minimize the need for future rework and the risk of failure, in Validation Of Smart Sensors For AI-Based Condition Monitoring In Industry.
Quadric’s Steve Roddy looks at the new approach to ML networks recently proposed by researchers from MIT and CalTech, known as the Kolmogorov Arnold Network, in KANs Explode!
Arm’s Vincent Yang examines a method that allows for the extraction of states from registers or latches that are stitched into the scan chains, providing critical diagnostic insights, in Understanding Scandump: A Key Silicon Debugging Technique.
Ansys’ Marc Swinnen explains the different classes of AI implementations in the EDA market, where they should be used, and what sort of results to expect from them, in Physics-Aware AI Is The Key To Next Gen IC Design.
Power architect Barry Pangrle checks out several approaches to silicon health and performance monitoring for SoCs, in Margin Sensors In The Wild.
Cadence’s Gautam S. shows how PCIe links are poised to take on a role of higher importance in systems as accelerated computing goes mainstream, in PCIe 7.0 Takes Center Stage At PCI-SIG DevCon ’24.
Rambus’ Nidish Kamath points to a way to deliver the bandwidth and capacity needed for a major shift in the mobile user experience, in LPDDR Memory Is Key For On-Device AI Performance.
Sponsor White Papers
A High-Capacity Solution For Power And Signal Integrity On 2.5D Silicon Interposers
Challenges and solutions for interposers for advanced packaging architectures.
How Does Reclaiming Data Center Lost Capacity Result In Return On Investment?
Effectiveness of long-term data center management solutions, maximizing efficiency via capacity recovery.
Testing PCI Express 5.0 PHY Transmitter Performance Without Analysis Software
How to characterize PCIe 5.0 PHY designs to avoid issues such as signal integrity and reliability prior to manufacturing.
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