A High-Capacity Solution for Power and Signal Integrity on 2.5D Silicon Interposers

Challenges and solutions for interposers for advanced packaging architectures.


The present trends in technology — such as increasing demand for computational power from CPUs and GPUs, connectivity driven by Internet of Things (IoT), data demands around connected and self-driving cars, and the design of processors optimized for artificial intelligence (AI) — require more functionality from integrated circuits. As designers struggle to find ways to scale with complexity and density limitations of traditional flat 2D-IC architectures, advanced packaging techniques offer an opportunity to continue functional densification and performance improvements while meeting form-factor constraints and cost. Interposers are an integral part of advanced packaging architectures, as they provide high connectivity between chiplets.

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