tag: interposers

Why There Are Still No Commercial 3D-ICs
By Brian Bailey - 29 Jan, 2024 - Comments: 0

Building chips in three dimensions is drawing increased attention and investment, but so far there have been no announcements about commercial 3D-IC chips. There are some fundamental problems that must be overcome and new tools that need to be developed. In contrast, the semiconductor industry is becoming fairly comfortable with 2.5D integration, where individual dies are assembled on some k... » read more

2023: A Good Year For Semiconductors
By Brian Bailey - 21 Dec, 2023 - Comments: 0

Looking back, 2023 has had more than its fair share of surprises, but who were the winners and losers? The good news is that by the end of the year, almost everyone was happy. That is not how we exited 2022, where there was overcapacity, inventories had built up in many parts of the industry, and few sectors — apart from data centers — were seeing much growth. The supposed new leaders we... » read more

3D-ICs May Be The Least-Cost Option
By Brian Bailey - 30 Nov, 2023 - Comments: 1

When 2.5D and 3D packaging were first conceived, the general consensus was that only the largest semiconductor houses would be able to afford them, but development costs are quickly coming under control. In some cases, these advanced packages actually may turn out to be the lowest-cost options. With stacked die [1], each die is considered to be a complete functional block or sub-system. In t... » read more

Heterogeneous Integration Finding Its Footing
By Ed Sperling - 19 Oct, 2023 - Comments: 0

Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom IC & PCB Group; and Tony Mastroianni, advanced packagin... » read more

Preparing For Commercial Chiplets
By Ed Sperling - 24 Aug, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the path to commercialization of chiplets with Saif Alam, vice president of engineering at Movellus; Tony Mastroianni, advanced packaging solutions director at Siemens Digital Industries Software; Mark Kuemerle, vice president of technology at Marvell; and Craig Bishop, CTO at Deca Technologies. What follows are excerpts of tha... » read more

Thermal Integrity Challenges Grow In 2.5D
By Ann Mutschler - 13 Apr, 2023 - Comments: 3

Thermal integrity is becoming much harder to predict accurately in 2.5D and 3D-IC, creating a cascade of issues that can affect everything from how a system behaves to reliability in the field. Over the past decade, silicon interposer technology has evolved from a simple interconnect into a critical enabler for heterogeneous integration. Interposers today may contain tens of dies or chiplets... » read more

True 3D Is Much Tougher Than 2.5D
By Brian Bailey - 23 Mar, 2023 - Comments: 0

Creating real 3D designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools. While there has been much discussion about 3D designs, there are multiple interpretations about what 3D entails. This is more than just semantics, however, because each packaging option requires different design approaches and technologies. And a... » read more

The Race Toward Mixed-Foundry Chiplets
By Ann Mutschler - 23 Mar, 2023 - Comments: 1

Creating chiplets with as much flexibility as possible has captured the imagination of the semiconductor ecosystem, but how heterogeneous integration of chiplets from different foundries will play out remains unclear. Many companies in the semiconductor ecosystem are still figuring out how they will fit into this heterogeneous chiplet world and what issues they will need to solve. While near... » read more

Improving Performance And Power With HBM3
By Andy Patrizio - 30 Jan, 2023 - Comments: 0

HBM3 swings open the door to significantly faster data movement between memory and processors, reducing the power it takes to send and receive signals and boosting the performance of systems where high data throughput is required. But using this memory is expensive and complicated, and that likely will continue to be the case in the short term. High Bandwidth Memory 3 (HBM3) is the most rece... » read more

What Does 2023 Have In Store For Chip Design?
By Brian Bailey - 26 Jan, 2023 - Comments: 0

Predictions seem to be easier to make during times of stability, but they are no more correct than at any other period. During more turbulent times, fewer people are courageous enough to allow their opinions to be heard. And yet it is often those views that are more well thought through, and even if they turn out not to be true, they often contain some very enlightening ideas. 2022 saw some ... » read more

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