tag: interposers

Choosing The Correct High-Bandwidth Memory
By Ann Mutschler - 25 Jan, 2023 - Comments: 0

The number of options for how to build high-performance chips is growing, but the choices for attached memory have barely budged. To achieve maximum performance in automotive, consumer, and hyperscale computing, the choices come down to one or more flavors of DRAM, and the biggest tradeoff is cost versus speed. DRAM remains an essential component in any of these architectures, despite years ... » read more

Multi-Die Integration
By Ed Sperling - 04 Jan, 2023 - Comments: 0

Putting multiple heterogeneous chips is the way forward for improved performance and more functionality, but it also brings a host of new challenges around partitioning, layout, and thermal. Michael Posner, senior director for die-to-die connectivity at Synopsys, talks about the advantages of 3D integration, why it’s finally going mainstream, and what’s needed in the EDA tools to make this ... » read more

Designing For Multiple Die
By Ann Mutschler - 21 Dec, 2022 - Comments: 1

Integrating multiple die or chiplets into a package is proving to be very different than putting them on the same die, where everything is developed at the same node using the same foundry process. As designs become more heterogeneous and disaggregated, they need to be modeled, properly floor-planned, verified, and debugged in the context of a system, rather than as individual components. Typi... » read more

Heterogeneous Integration Issues And Developments
By Ed Sperling - 14 Dec, 2022 - Comments: 0

There are a slew of new developments in advanced packaging, from new materials, chiplets, and interconnect schemes, to challenges involving how to physically put chips in a package, metallization, thermal cycling, and parasitics in the interconnect path. Dick Otte, CEO of Promex Industries, talks about how this will change chip design and manufacturing, and how those changes are likely to unfol... » read more

3D-IC Reliability Degrades With Increasing Temperature
By Ann Mutschler - 14 Dec, 2022 - Comments: 0

The reliability of 3D-IC designs is dependent upon the ability of engineering teams to control heat, which can significantly degrade performance and accelerate circuit aging. While heat has been problematic in semiconductor design since at least 28nm, it is much more challenging to deal with inside a 3D package, where electromigration can spread to multiple chips on multiple levels. “Be... » read more

The Computational Electromagnetics Simulation Challenge Of 3D-IC
By Kelly Damalou - 29 Nov, 2022 - Comments: 0

By Kelly Damalou and Matt Commens Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging technologies have advanced the state of the art beyond SoC technologies which first united digital, analog, and memory functions on a single chip in the '90s. These ... » read more

Is UCIe Really Universal?
By Brian Bailey - 22 Nov, 2022 - Comments: 3

Chiplets are rapidly becoming the means to overcome the slowing of Moore's Law, but whether one interface is capable of joining them all together isn't clear yet. The Universal Chiplet Interconnect Express (UCIe) believes it will work, but some in the industry remain unconvinced. At least part of the problem is that interconnect standards are never truly finished. Even today, the protocols tha... » read more

What’s So Different About Interposer Signal Integrity?
By Kelly Damalou - 28 Oct, 2022 - Comments: 0

By Kelly Damalou and Pete Gasperini To achieve gains in power, performance, area, and cost, 3D-IC architectures are pushing electronics design to new limits. Silicon integration technology and associated devices have undergone an impressive evolution over the last several decades. Their development encourages technological advancement in applications like high-performance computing, Artificial... » read more

Which Foundry Is In The Lead? It Depends.
By Ed Sperling - 26 Oct, 2022 - Comments: 2

The multi-billion-dollar race for foundry leadership is becoming more convoluted and complex, making it difficult to determine which company is in the lead at any time because there are so many factors that need to be weighed. This largely is a reflection of changes in the customer base at the leading edge and the push toward domain-specific designs. In the past, companies like Apple, Google... » read more

Holistic 3D-IC Interposer Analysis In Product Designs
By Ben Gu - 22 Sep, 2022 - Comments: 1

The miniaturization trend in electronic devices and the rise in smart and IoT device segments make adopting heterogeneous integration of chip components or 3D-ICs a viable option for miniaturization and better interconnection. This vertical stacking of ICs enables the next generation of sophisticated, intelligent devices, necessitating high chip density and terabytes of bandwidth. As per the f... » read more

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