Top Stories
Reducing Power Delivery Overhead
Pain vs. gain in optimizing the power delivery network in complex chips and packages.
Lower Power Chips: What To Watch Out For
Increasing interactions and complexity require more tools and cross-domain techniques.
Retimers Replacing Redrivers As Signal Speeds Increase
Redrivers are running out of steam as more devices are connected over high-speed protocols.
New Power, Performance Options At The Edge
Tradeoffs grow as chipmakers leverage a variety of architectural choices.
Blogs
Siemens EDA’s Harry Foster examines the relationship between verification maturity and non-trivial bug escapes into production and the effect of safety-critical design practices on the level of silicon success, in ASIC/IC Verification Trends With A Focus On Factors Of Silicon Success.
Arm’s Eddie Ramirez argues for thinking outside the data center to bring computing closer to users, in For The Edge, It’s All About Location, Location, Location.
Synopsys’ Manu Verma explains the importance of getting the right mix of analog and digital blocks for best performance, lowest power, and smallest area, in Best 112G SerDes IP Architecture.
Cadence’s Paul McLellan reports that the applications enabled by hyperscale computing are seen by most consumers as positive, while data privacy and security concerns remain, in Hyperconnectivity’s Impact On Consumers.
Ansys’ Sean Patterson digs into the design of lidar systems, in High-Fidelity Optical Edge Case Analyses For Lidar Simulation.
Rambus’ Tim Messegee lobbies for moving beyond the classic architecture of the server through disaggregation and composability, in CXL Signals A New Era Of Data Center Architecture.
Infineon’s Suresh Thangavel lays out why SiC MOSFETs improve power conversion efficiencies and lower system costs for solar and battery storage applications, in Benefits Of SiC For String Inverters.
Fraunhofer’s Olaf Enge-Rosenblatt & Andy Heinig look at AI methods and when they can be used effectively from the user perspective, in Getting Realistic About AI.
Sponsor White Papers
Gate Drive Solutions For CoolGaN 600 V HEMTs
Exploiting the full potential of GaN.
AiP/AiM Design For MmWave Applications — Advanced RF Front-End Design Flows From Concept To Signoff
The challenge of antenna design and simulation as implemented with antenna-in-package (AiP) and antenna-in-module (AiM) advanced packaging technology.
Bringing Reset And Power Domains Together
Confronting issues due to UPF instrumentation.
When Failure Is Not An Option: Improving Medical Device Reliability
Strategies and protocols to improve medical electronic device reliability and how these strategies will benefit both the patient and the manufacturer.
MIPI Drives Performance For Next-Generation Displays
Learn about growing bandwidth challenges and the development of MIPI DSI-2 and DSI-2 VESA DSC IP.
Dynamic Fault Injection Into Digital Twins Of Safety-Critical Systems
A technology for dynamically introducing fault structures into digital twins without the need to change the virtual prototype model.
Optimize Physical Verification Cost Of Ownership With Elastic CPU Management
Learn how IC Validator elastic CPU management technology delivers significant value in the design flow.
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