Top Stories

Heat-Related Issues Impact Reliability In Advanced IC Designs
Retaining data in memories and processors becomes more difficult as temperatures rise in advanced packages and under heavy workloads.

IC Power Optimization Required, But More Difficult To Achieve
As chips and systems grow in complexity, power budgets are getting stretched. Just shifting left doesn’t solve all problems.

Data Center Thermal Management Improves
CFD, multi-physics, and digital twins play increasing roles in addressing heat within and between server racks.

Managing kW Power Budgets
Strategies for dealing with increasing compute demands from AI and other applications.

Blogs

Synopsys’ Priyank Shukla presents a comprehensive analysis of 3nm silicon results and their significance in the context of high-performance compute disaggregation, in 224Gbps PHY For The Next Generation Of High Performance Computing.

Siemens EDA’s Gregory Beers emphasizes the value of flex-specific rules, and communication with fabs about multi-zone stack-up details, in A Guide To Rigid-Flex PCB Design.

Fraunhofer IIS/EAS’ Ron Martin provides a qualitative comparison of different sensor performance indicators, in Sensor Requirements For Developing Robust Environment Perception Systems.

Rambus’ Lou Ternullo digs into PCIe 7.0 and what’s new, including a 2X faster data rate and an optical interconnect option, in PCIe 7.0: Speed, Flexibility & Efficiency For The AI Era.

Cadence’s Geeta Arora delves into the semantics of ATS request-completion protocol and invalidation protocol, in PCIe 6.0 Address Translation Services: Verification Challenges And Strategies.

Arm’s Marcus Corbin explains how a DNN-based system can recognize a person based on the characteristics of their speech, with detailed findings from a research project, in On-Device Speaker Identification For Digital Television (DTV).

Ansys’ Kiyoung Jung and KAIST’s Kyutae Kim show why the large-scale adoption of hydrogen as a cleaner fuel depends on solving issues related to flashback, NOx emission, and combustion instabilities, in How Simulation Addresses Hydrogen Fuel Challenges.

Power architect Barry Pangrle examines the roadmap to increase the manufacturing competitiveness of the U.S. semiconductor industry, in CHIPS For America’s National Semiconductor Technology Center (NSTC) Program.

Quadric’s Steve Roddy shows a graph compiler that enables rapid support for emerging AI models, in ConvNext Runs 28X Faster Than Fallback.

Sponsor White Papers

Rigid-Flex PCB Design Guidelines
How to work with bendable boards without sacrificing performance or reliability.

Evolving Edge Computing
Market trends presenting new challenges and opportunities at the edge.

Speed AND Accuracy: First-Of-Its-Kind Broad-Spectrum CFD Solver Built Natively On GPUs
Balancing the need for accurate simulations with shorter time to solutions.

Cadence Janus NoC System IP
How to address interconnect challenges and reduce wire congestion to achieve design goals.

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