Special Report
Why EUV Is So Difficult
One of the most complex technologies ever developed is getting closer to rollout. Here’s why it took so long, and why it still isn’t a sure thing.
Top Stories
More EUV Mask Gaps
Pellicles and inspection remain problematic.
Making 2.5D, Fan-Outs Cheaper
Standards, new materials and different approaches are under development to drive 2.5D, 3D-ICs and fan-outs into the mainstream.
Oscilloscopes: The EE’s Stethoscope
The hardware engineer’s most basic tool continues to evolve. It can do much more in less time.
Blogs
Editor In Chief Ed Sperling looks at why known good die are suddenly important again and how to achieve that, in Advanced Packaging Requires Better Yield.
Executive Editor Mark LaPedus talks with Inpria’s CEO about EUV resist challenges, in Inside EUV Resists.
Technical Editor Katherine Derbyshire shows why some analyses are so misleading, in The Limits Of The Lifecycle.
National Instruments’ David Vye contends that design trends in high-frequency component integration require a different approach, in Software Platforms Bridge The Design/Verification Gap For 5G Communications Design.
Mentor Graphics’ David Abercrombie digs into cut masks and how to comply with a variety of different rules, in Fill/Cut Self-Aligned Double-Patterning.
Applied Materials’ Selim Nahas explains how to limit the impact of different skill sets and perceptions in semiconductor manufacturing, in Human Factors In Automation Software.
Coventor’s Jimmy Gu points to the value of using real-world tools to teach students the latest commercial technologies, in Bringing Advanced Semiconductor Manufacturing Technologies To Higher Education.
Sponsor White Papers
A Product Development Flow For 5G/LTE Envelope Tracking Power Amplifiers
Techniques to improve the efficiency and linearity of RF power amplifiers.
Mastering The Magic Of Multi-Patterning
Making this work requires a thorough understanding of the techniques.
