Top Stories
The Chip Industry’s Next-Gen Roadmap
SRC’s new CEO sheds some light on next-gen projects involving everything from chiplets to hyperdimensional computing and mixed reality.
48V Applications Drive Power IC Package Options
As newer power-semiconductor processes become mainstream, new packaging approaches are required for thermal and parasitic issues.
Stronger, Better Bonding In Advanced Packaging
Researchers zero in on different copper structures.
Blogs
Executive Editor Mark LaPedus’s conversation with industry analysts reveals a bright outlook for 2021, along with some challenges, in Fearless Chip Forecasts For 2021.
Amkor’s Prasad Dhond examines the key sensors and components that enable the latest automotive safety features, in A Look Inside ADAS Modules.
Coventor’s Jeonghoon Kim demonstrates how virtual process libraries can accelerate semiconductor process development, in An Introduction To Virtual Semiconductor Process Evaluation.
Brewer Science’s Darin Collins and Jessica Albright lay out three approaches that work in tandem for improved materials characterization, in Eyes On Zero Defects: Defect Detection And Characterization Metrology.
SEMI’s Serena Brischetto speaks with EV Group’s Elisabeth Brandl about how the power electronics industry is transitioning from silicon to wide bandgap compound semiconductor materials such as silicon carbide and gallium nitride, in Mobility And 5G Drive Adoption Of New Materials For Power Devices.