Special Report
Breaking The 2nm Barrier
New interconnects and processes will be required to reach the next process nodes.
Top Stories
Shortages, Challenges Engulf Packaging Supply Chain
Innovative business models emerge, but so does possibility of consolidation.
Power Converter Chip Research Booms
New materials, different approaches could have long-term impact for majority of electronics.
Blogs
Executive Editor Mark LaPedus examines GlobalWafers’ move to buy rival Siltronic amid booming wafer demand, in More Silicon Wafer Consolidation.
Amkor’s Shaun Bowers digs into packaging changes required for wide-bandgap devices, in Increasing The Conductive Density Of Packaging.
Quik-Pak’s Ken Molitor looks at the impact of small-form-factor packages on 5G electrical and thermal performance, in Packaging Demands For RF And Microwave Devices.
SEMI’s Christian Dieseldorff observes that from 2019 through the end of 2021, China will have increased wafer capacity for memory by 95%, foundry by 47%, and analog by 29%, in China Passes Americas And Japan In IC Capacity.
