Top Stories

MOCVD Vendors Eye New Apps
VCSELs, mini/microLEDs, power and RF devices point to another boom for this technology.

Moving To GAA FETs
Why finFETs are running out of steam, and what happens next.

Demand Picks Up For 200mm
Lack of used equipment, spare parts are limiting capacity at new fabs.

Blogs

Editor In Chief Ed Sperling examines the good and bad of multi-region manufacturing, in The Risk Of Two Supply Chains.

SEMI blogger Walt Custer shows how the new virus has left the entire supply chain scrambling, in Impact Of Coronavirus Could Threaten Global Electronics Growth.

Lam’s David Haynes explains why upgrading 200mm equipment with advances made at 300mm is a way to quickly improve yield and capacity, Using New Technologies On Smaller Wafers.

Sponsor White Paper

Meeting Commercial Demands With XM3 Module Platform
With SiC-optimized packaging, an XM3 module platform targets 100 kW – 300 kW applications for power density.