Special Report
3D NAND’s Vertical Scaling Race
More competition, business uncertainty, and much more difficult manufacturing processes.
Top Stories
200mm Demand Surges
Despite slowdown in some areas, shortages will continue into 2021 due to lack of equipment.
The Darker Side Of Hybrid Bonding
The approach offers huge performance gains, but pitfalls remain.
Blogs
In a conversation with Executive Editor Mark LaPedus, the SIA explains what the recent passage of an important U.S. government act means to the semiconductor industry, in Regaining U.S. Chip Competitiveness.
SEMI’s Clark Tseng calculates that the total semiconductor equipment market — led by investments in China, Taiwan, and Korea — is on track to beat its previous high, in Chip Equipment Billings Soar In 2020.
Amkor’s Ajay Sattu explains how keeping track of how a product moves through the supply chain provides real-time access to manufacturing information and meets end user safety requirements, in Adding Value With Unit Level Traceability (ULT) In Automotive Packaging.
Quik-Pak’s Annette Teng recommends using backgrinding and die-attach film to optimize systems-in-package for consumer and communications devices, in Wafer Prep Key To Thinning SiP.
Sponsor White Paper
Novel Etch Technologies Utilizing Atomic Layer Process For Advanced Patterning
A new approach combining atomic layer deposition and organic film etch process may solve critical challenges in the various processes in advanced nodes.
