Special Report
Moore’s Law: A Status Report
The ability to shrink devices will continue for at least four more nodes as EUV begins to ramp, but it’s just one of a growing number of options.
Top Stories
Will Self-Heating Stop FinFETs
Central fins can be up to 50% hotter than other fins, causing inconsistent threshold behavior and reliability problems.
Inside Next-Gen Transistors
Coventor’s CTO looks at new types of transistors, the expanding number of challenges at future process nodes, and the state of semiconductor development in China.
Blogs
Editor in Chief Ed Sperling examines why a number of individual steps proved so difficult, and how that will play out for future chips, in The Evolution Of EUV.
Executive Editor Mark LaPedus questions whether China can succeed in the IC equipment industry, in Sizing Up China’s Fab Tool Biz.
Technical Editor Katherine Derbyshire shows how restrictions on hiring will unfold for people who have nothing to do with technology, in The Other Side Of H1-B Visas.
Coventor’s Mustafa Akbulut explains how tiny variations can result in much bigger problems, in Photoresist Shape In 3D.
SEMI’s Jamie Girard zeroes in on issues involving trade, taxes, immigration and R&D in discussions with U.S. policymakers, in SEMI Members Mobilize For 2017 SEMI Washington Forum.
Semico Research’s Rich Wawrzyniak contends that while design costs have been rising steadily since 40nm, the acceleration at 7nm and 5nm is worrisome, in Impact Of Rising SoC Design Costs On Innovation.
Sponsor White Paper
Understanding How Small Variations In Photoresist Shape Significantly Impact Multi-Patterning Yield
How shapes can affect the fin shape and BEOL capacitance in a finFET device.
