Top Stories
Will Fab Tool Boom Cycle Last?
Early predictions are for solid growth in 2018, fueled by demand for memory and logic at advanced 10/7nm.
The Next 5 Years Of Chip Technology
Scaling logic beyond 5nm; the future of DRAM, 3D NAND and new types of memory; the high cost of too many possible solutions.
Chipmakers Look To New Materials
Silicon will be supplemented by 2D materials to extend Moore’s Law.
Blogs
Editor In Chief Ed Sperling argues that future progress increasingly will require a mix of different materials and disciplines, but silicon will remain a key component, in Silicon’s Long Game.
Executive Editor Mark LaPedus peers into the future with AI, neural nets and quantum computing, in What’s Next With Computing?
Applied Materials’ Mike Rosa examines the state of 5G technology, what needs to be done and why the confluence of this technology with AI marks an inflection point, in Get Ready For 5G.
Lam Research’s Larry Zhao explains why interconnects are becoming the performance bottleneck in advanced-node chips, in All About Interconnects.
KLA-Tencor’s Andrew Cross zeroes in on how to manage hotspots at 7/5nm and beyond, in Process Window Discovery And Control.
SEMI’s Cherry Sun observes that global industry cooperation continues to grow, in Huge Opportunities In China.
GlobalFoundries’ Mark Granger questions how far existing technology can be extended, in Toward Self-Driving Cars.
Sponsor White Paper
Nontraditional Post Develop Inspection And Review Strategy For Via Defects
A new way to do full-wafer, in-line monitoring to identify missing vias in the back end of line.