Special Report
SiPs: The Best Things In Small Packages
Better materials and processes enable smaller, higher performing systems-in-package.
Top Stories
Which Foundry Is In The Lead? It Depends
More factors need to be weighed than just process scaling; leadership can vary month-to-month and by application.
Wafer Cleaning Becomes Key Challenge In Manufacturing 3D Structures
Cleaning is critical to yield and reliability, but cleaning what you can’t see requires new approaches, materials, and equipment.
What’s Different About Next-Gen Transistors
Advanced etch holds key to nanosheet FETs; evolutionary path for future nodes.
Chip Industry Earnings: A Mixed Bag
Intel, Samsung & more earnings; post-lockdown letdown for consumer-related spending; impact of export restrictions; memory sector woes.
Video
Heterogeneous Integration Issues And Developments
Why putting different chips and chiplets into a package is harder than it sounds.
Blogs
SEMI’s Gity Samadi and NextFlex’s Paul Semenza look at novel interconnect and attach techniques from FLEX 2022 for more compact, lightweight, and higher performance flexible electronics, in Additive Techniques For Flexible Hybrid Electronics Packaging And Integration With Human.
Coventor’s Qingpeng Wang shows how to overcome limited wafer test data when choosing a DRAM patterning scheme, in Insights Into Advanced DRAM Capacitor Patterning: Process Window Evaluation Using Virtual Fabrication.
Amkor’s Vineet Pancholi and Dennis Dinawanao present test steps and parameters for new and established power technologies, in Production Testing Of Discrete Power Products.
Sponsor White Papers
Realization Of Sub-30-Pitch EUV Lithography Through The Application Of Functional Spin-On Glass
Patterning performance strongly depends on resist/underlayer adhesion. With the appropriate adhesion, one can realize 28-nm pitch printing with defect-free depth of focus larger than 300 nm and unbiased line-width roughness ∼2.2 nm.
Metal Oxide Resist (MOR) EUV Lithography Processes For DRAM Application
An integrated approach with a new PEB oven reduces defectivity.
Survey: 2022 Luminaries Report Positive EUV Impact On Mask Trends
The ability to make curvilinear masks and the availability of multi-beam mask writers was less of an issue this year.
Pathfinding By Process Window Modeling
Virtual fabrication for evaluating the process window of an advanced DRAM capacitor patterning process.
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