Special Report
Why Is My Device Better Than Yours?
As the industry runs out of comparative metrics, differentiation becomes a serious issue.
Top Stories
Balancing The Cost Of Test
The cost of test was approaching the cost of manufacturing, but have new test methodologies brought that under control? And are new challenges around the corner?
2.5D Timetable Coming Into Focus
Real chips under development despite gaps in design and packaging flows. Work is under way to cut interposer costs and standardize electrical connections.
Are Models Holding Back New Methodologies
ESL methodologies are not coming together for many companies, but there is hope on the horizon.
Advanced Nodes Drive Changing EDA Requirements
Advanced manufacturing processes require the ecosystem of foundries, EDA tool suppliers and IP developers to work closer than ever before.
Blogs
Editor In Chief Ed Sperling observes that the concept of a system will change radically as we move into stacked die and the IoT in, Redefining A System…And Why It Matters.
Technology Editor Brian Bailey examines a case that spanned two continents, eight companies and 26 years—and it still won’t go away—in Legal Battlefield In Emulation.
Cadence’s Frank Schirrmeister points to a future that is multi-platform, with natural human input and realistic output, in System Design Enabling Surround Computing.
Mentor Graphics’ Jon McDonald applies Sun Tzu’s Art of War principles to system-level modeling in, How Many Levels Of Abstraction Are Needed?
Open Silicon’s Jeff Scott finds die reuse only improves costs when the dies are actually re-used in, A New Reuse Paradigm To Take 2.5D Packaging Technology Mainstream.
And eSilicon’s Mike Gianfagna finds that real-time quoting for semiconductor transactions is hitting a nerve in, Changing The World, One Transaction At A Time.
