Special Report
Toward Agentic Verification
Using AI agents for verifying designs holds huge potential, but can it deliver? And what comes next?
Top Stories
Swapping Out Chiplets: I/Os Vs. Compute
Multi-die assemblies give chip architects the option to change some dies while keeping the rest of the system intact, but which is best to keep?
Observability Is Essential For Modern Silicon
What on-die visibility reveals, and why it is especially important for AI, automotive, aerospace, and advanced packaging.
Using AI To Monitor Dashboards In Chips And Systems
AI agents can be used to identify potential issues during operation and react before it’s too late.
Confusion Grows With More Interconnect Options And Tradeoffs
Each standard serves a specific use case, so chip architects are choosing more than one for a single design.
Options Grow For Standardizing Data Movement And Sharing Resources
But figuring out which ones to use, and when to use them, isn’t always clear.
Video
Overcoming Bottlenecks In Data Movement
Where the choke points are in AI systems and what to do about them.
Opinion
Disturbance In Verification
We have started to see what may be the largest disturbance in the role of a verification engineer since the founding of the industry. Should you be worried?
Sponsor Blogs
Axiomise’s Ashish Darbari and Bing Xue show how to ferret out deep corner cases that can cause deadlocks and silent data corruption, in Why Your NoC Verification Strategy Must Consider Using Formal.
Siemens EDA’s Rory Riggs explains the need to look beyond traditional spacing and distance checks for electrical verification and sign-off of PCBs, in Automating Traditional PCB Layout Verification With Electrically Based Design Rule Checks.
Cadence’s Rajshekharayya Hiremath describes a scalable path for multi-PVT library characterization as cell and corner counts increase, in A Scalable Answer To Advanced-Node Characterization.
Arteris’ Andy Nightingale looks at the impact of workloads on interconnects, in Using SystemC TLM Modeling To Solve AI Data Movement Challenges.
Vinci’s John Bruggeman explains why continuous validated physics reasoning is essential in the engineering workflow, in Foundation Model For Physics: The Next Layer Of Intelligence For Engineering.
Synopsys’ Taruna Reddy shows the benefits of automating a wide range of tasks, such as waveform inspection, logfile analysis, and source code navigation, in Faster Verification Debug With AI.
Baya Systems’ Nandan Nayampally zeroes in on Cerebras’ chip and how it broke all the rules for design, in Wafer-Scale vs. Chiplets: The New War? Part 1.
Keysight’s Amritam Putatunda looks at how to balance GPU, memory, storage, and network resources, in The Shape Of Prompts: Exploring Their Effect On Inference Infrastructure.
Movellus’ Aakash Jani and Venkatesh Santhanagopalan explain how to optimize SoCs to run at their true power and performance limits throughout the full system lifecycle, in A Bench-To-In-Field Telemetry Platform For Data Center Power Management.
Sponsor White Papers
Deterministic, Solver-Accurate Thermal and Warpage Analysis at Manufacturing Resolution for Advanced 2.5D HBM Packages
Combining manufacturing-resolution geometry with deterministic, solver-accurate computation changes the economics of thermal analysis for advanced 2.5D packages.
Multiphysics Fusion Technology for Multi-Die Designs Explained
Why multiphysics analysis must move earlier in the design flow, and how a unified approach enables continuous validation from exploration through signoff.
Rethinking AI-Scale Data Center Validation
10 reasons 1.6T demands a new class of test systems.
From Billions Of Violations To Actionable Insights: Calibre Vision AI
Deliver faster insight, eliminate wasted debug cycles, and significantly compress overall DRC iteration time at advanced nodes.
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