Top Stories

AI In Inspection, Metrology, And Test
AI systems are making inroads into IC manufacturing and assembly, but it’s slow going — on purpose.

Sharing Secure Chip Data For Analytics
Security practices are evolving to meet sharing data across siloed engineering teams, but they still have a long way to go.

Monitoring Chips On Many Levels
Understanding chip behavior, performance, and aging from the inside.

Blogs

Onto’s Will Zhou explains how neural networks perform defect classification and many other tasks, in How Do Machines Learn?

Synopsys’ Taylor Armerding examines the effort to establish automotive cybersecurity standards and best practices, in Security For Cars That Are Smartphones On Wheels.

Advantest’s Matthias Stahl lays out ways of keeping up with the test requirements of a new generation of devices, in ATE In The Age Of Convergence And Exascale Computing.

Sponsor White Papers

Advantages Of Picosecond Ultrasonic Technology For Advanced RF Metrology
Less stringent calibration is one of the advantages when using Picosecond Ultrasonics for advanced radio frequency (RF) applications.

Finding And Fixing Design And Testbench Coding Errors On The Fly
How to catch many classes of errors “on the fly” when coding register-transfer level (RTL) design and developing the hardware verification language (HVL) testbench.