Special Report
AI Accelerators Usher In New Era Of IC Test
The number and variety of test interfaces, coupled with increased packaging complexity, are adding a slew of new challenges.
Top Stories
What’s Failing At The Interface
In advanced packages, the interface is where problems show up, but rarely where they begin.
Untrusted Analog Components Add Risks For Critical Infrastructure
Suggested alternative: Identifying counterfeits requires adding certificate processes, increasing equipment investments and a lot more coordination.
Video
Improving Yield Through Shared Data
The case for sharing test, manufacturing, and design data.
Sponsor Blogs
Onto Innovation’s Christopher Haire explains how to stay inside increasingly narrow process windows as specialty devices scale, diversify, and enter high-volume production, in The Specialty Device Surge Part 2: The Process Control Challenges Of MEMS, Co-Packaged Optics, And More.
PDF Solutions’ Christophe Begue warns that deploying AI on top of fragmented, siloed, inconsistently formatted data produces unreliable results, in Breaking The Legacy Trap: How Semiconductor Executives Can Accelerate AI Adoption And Transform IT Applications At The Same Time.
Synopsys’ Adam Cron shows how a convergence of DFT techniques and the proliferation of in-silicon monitors can flag potential failures before they occur, in Enhancing Silicon Reliability With In-System Test And SLM Data.
Nordson’s Charlie Zhu explores how deep learning enables systems to detect and flag issues that could otherwise be misread or missed, in The Smart Advantage: How Artificial Intelligence Is Transforming Inspection And Metrology In Semiconductor Manufacturing.
Advantest’s Vincent Chu looks at the modern test landscape, including cloud-based virtualization, real-time data synchronization, and scalable AI/ML deployment, in Harnessing Digital Twins And AI/ML For Smarter Semiconductor Test Optimization.
proteanTecs’ Nir Sever looks at how embedded intelligence enables a system to respond to critical events before they cause failures in runtime applications, in Why Hardware Monitoring Needs Infrastructure, Not Just Sensors.
Sponsor White Papers
AI Data Center Providers Seek Power And Bandwidth Promise In CPO
Insights on implementing a test strategy from bench validation to high-volume that enables a seamless path to scale.
Mid-Infrared Ellipsometry For Optical Critical Dimension Metrology
Mid-infrared ellipsometry, enabled by tunable quantum cascade lasers and polarization modulation, offers a transformative approach to optical critical dimension metrology for advanced semiconductor structures.
Platform-Led AI Analytics For The Semiconductor Ecosystem
Moving beyond the AI pilot stage and enabling AI’s adoption across the entire design and manufacturing semiconductor supply chain at scale.
Human-Centered Agentic AI Workflows For RTL Verification
Embedding AI agents to improve productivity without sacrificing reliability.
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