Top Stories

Taming Concurrency
What hoops will designers have to jump through to avoid concurrency bugs?

Mostly Upbeat Outlook For Chips
2019 will be a year of change for the semiconductor industry as new fields drive technological advancements.

Process Variation And Aging
Experts at the Table: How progress in the semiconductor industry is making transistor aging even more difficult to calculate.

Videos

Boosting Analog Reliability
What are the challenges in dealing with variability and physical effects in mixed signal designs?

Thermal Guard-Banding
Why more precision is necessary at advanced nodes.

Blogs

Editor In Chief Ed Sperling examines the real impact of putting a supercomputer in your pocket, in Low Power At The Edge.

Synopsys’ Susantha Wijesekara and Himanshu Bhatt describe a new low-power verification flow that offers better runtime performance and reduced memory consumption without compromising QoR, in Efficient Hierarchical Verification For Low Power Designs.

Last year, 84% of FPGAs went into production with non-trivial bug escapes, warns Mentor’s Harry Foster, in Trends In FPGA Effectiveness: The 2018 Wilson Research Group Functional Verification Study.

Arm’s Chris Shore posits that adding more cloud compute won’t solve the problem of managing exponentially growing quantities of data, in Cutting the Cord: How Edge Intelligence Is Enabling the IoT To Go Where Cloud Can’t.

Rambus’ Mondeep Thiara contends that even though PCIe 5.0 offers higher performance and lower latency, Gen 4 likely will stay dominant in many markets, in PCIe 4.0 Hangs In, PCIe 5.0 Coming On Strong.

In case you missed this week’s Packaging, Test & Materials newsletter, check out stories on roadblocks to reliability in automotive electronics, roadmaps for progress in packaging in More 2.5D/3D, Fan-Out Packages Ahead, and what four industry experts think The Next Semiconductor Revolution will be.