Special Report
HBM3: Big Impact On Chip Design
New levels of system performance bring new tradeoffs.
Top Stories
Architecting Interposers
It’s not easy to include interposers in a design today, but as the wrinkles get ironed out, new tools, methodologies, and standards will enable it for the masses.
Get Ready For The Next Generation Of Wearable Tech
Smarts, not just functionality, is moving to everything from watches and glasses to clothing, but there are still barriers to overcome.
Will Co-Packaged Optics Replace Pluggables?
New options open the door to much faster and more reliable systems.
Blogs
Synopsys’ Moninder Singh explains why the complexity of interface IP makes it difficult to keep transistor netlist views logically equivalent to reference Verilog models, in Leveraging Symbolic Simulations For IO Verification.
Arm’s Remy Pottier contends that creating an ecosystem for pervasive computing systems will require extensive trial and error, in Six Things We Might Need For Pervasive Computing.
Fraunhofer’s Roland Jancke warns that special attention must be paid to the non-functional properties of RF components, in Challenges In RF Design.
Ansys’ Tyler Ferris identifies three places where electronics typically go bad on a PCB, in How To Identify Common Electronic Failures.
Infineon’s Olaf Bendix lays out steps to identify a suitable gate driver IC based on the peak current and power dissipation requirements of an application, in Choosing A Gate Driver For Silicon Carbide MOSFETs.
Rambus’ Paul Karazuba shows how to minimize performance overhead while protecting high-value data passed across interconnects, in Latency Considerations Of IDE Deployment On CXL Interconnects.
Cadence’s Shyam Sharma zeroes in on requirements to watch out for when combining multiple individual DRAMs to create higher-density memories, in Multi-DRAM Memory Subsystems In SoCs.
Siemens’ Joe Davis highlights problems in analyzing power for large analog designs, in Bringing Scalable Power Integrity Analysis To Analog IC Designs.
White Papers
How Semiconductor Solutions Address Safety Requirements Of Future Power Distribution Networks In Autonomous Vehicles
Bringing Intelligent Headlamps To Light Via Simulation
Introducing MPower
Execution Dependence Extension (EDE): ISA Support For Eliminating Fences
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