Top Stories
Flipping Processor Design On Its Head
AI workloads are changing processor design in some unexpected ways.
An Entangled Heterarchy
The informal structural hierarchy used in semiconductor design is imperfect but adequate for most tasks, yet other hierarchies are needed.
SRAM In AI: The Future Of Memory
Why SRAM is viewed as a critical element in new and traditional compute architectures.
Blogs
Fraunhofer IIS/EAS’ Jens Michael Warmuth warns that simply improving the failure rate is not enough for today’s electronics requirements, in Damage Detection For Reliable Microelectronics.
Arm’s Roberto Lopez Mendez digs into techniques for reducing the precision of weights, biases, and activations to enable real-time edge inference, in Neural Network Model Quantization On Mobile.
Ansys’ Marc Swinnen looks at rethinking dynamic voltage drop from the ground up, in Is Your Voltage Drop Flow Obsolete?
Cadence’s Hassan Moezzi makes the case for improving data center planning and operational lifecycle management with digital twins, in Reduce Data Center Over-Provisioning And Stranded Capacity For Sustainability.
Rambus’ Tim Messegee looks at how the third generation of HBM boosts bandwidth while improving power efficiency and memory access, in The Power Of HBM3 Memory For AI Training Hardware.
Siemens EDA’s Qazi Faheem Ahmed shows how dealing with power at each stage of design can help find and fix issues faster, in RTL Optimization Best Practices Help To Achieve Power Goals And Identify Reliability Issues Earlier.
Keysight’s Mike Wager explores the financial impact of adopting AI-augmented test automation, in Can Software Testing Deliver ROI?
Sponsor White Papers
3D Heterogenous Integration: Design And Verification Challenges
The emerging interconnect architecture of signal nets and power delivery networks call for innovative EDA tools with ultra-large data capacity and scalable compute technology.
Vision Transformers Change The AI Acceleration Rules
What makes vision transformers so special?
Thermal Warpage Simulation Of A Temperature-Dependent Linear Elastic Material Package
Advanced packaging in 3D and 2.5D IC design requires numerical analysis of thermal warpage in electronic devices.
Placement And CTS Techniques For High-Performance Computing Designs
Challenges in HPC designs and how to achieve maximum performance.
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