Advanced packaging in 3D and 2.5D IC design requires numerical analysis of thermal warpage in electronic devices.
The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool enables the designer to perform early design analysis that accurately predicts warpage, thereby shortening the design process.
The Cadence Celsius Thermal Solver integrated within the Cadence IC, package, and PCB implementation platforms provides early-stage system analysis of thermal and stress fields. This paper demonstrates the thermal warpage simulation capability of the Celsius Thermal Solver using a semiconductor package with a temperature-dependent linear elastic material and multilayer geometry. It validates the accuracy of the solver by comparing the simulation results with flip-chip package measurements from the literature, which uses analytical solutions. The simulation results correlate well with the measurement, proving the accuracy of the Celsius Thermal Solver in performing thermal warpage analysis.
Click here to read more.
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Leave a Reply