Celsius Thermal Solver

The Celsius Thermal Solver environment enables all aspects of thermal analysis to quickly and accurately identify thermal problems in IC packages, PCBs, and electronics systems. It features an innovative massive parallel solver technology that enables simulation speeds up to 10 times faster than conventional thermal simulators, with significantly reduced memory usage. It includes a powerful fin... » read more

Process Variation Not A Solved Issue

Semiconductor Engineering sat down to talk about process variation in advanced nodes, and how design teams are coping, with Christoph Sohrmann, a member of the Advanced Physical Verification group in Fraunhofer’s Division of Engineering of Adaptive Systems (EAS); Juan Rey, vice president of engineering at Mentor, A Siemens Business; and Stephen Crosher, CEO of Moortec Semiconductor. What foll... » read more

3D Thermal Simulation Of Resistive Heating

Joule heating, also known as resistive or Ohmic heating, is the power lost to heat as electrical current flows down a conductor. We were introduced to Joule’s first law (Power dissipation = I²R, VI, V²/R) way back in high school. From an electronics thermal simulation perspective it requires a full 3D electrical flow simulation to be conducted, and from that the Joule heating power dissipat... » read more

How To Get The Most Power While Being Cool To The Touch

Traditional electronics thermal management in high power applications such as telecommunication, networking, and computing involves keeping the operating junction temperatures at, or below, maximum rated values for the intended application, often with fans, blowers, heatsinks, etc. Mobile consumer electronics also have to be thermally managed to ensure that when a person uses the product, ‘to... » read more

Calibrating Electronics Thermal Simulation Models

‘Rubbish In, Rubbish Out’ is a common and well-accepted fact in the world of thermal simulation—actually any type of simulation, for that matter. Regardless of the technical capabilities of your thermal simulation tool, the accuracy of prediction will always be tightly coupled to the accuracy of the input data. In terms of electronics thermal simulation, the prediction of the internal ... » read more

Heat Problems Grow With FinFETs, 3D-ICs

From high-end consumer devices to rack-mounted arrays inside of data centers, thermal issues are becoming more serious—and getting much more attention. Driving this shift is the move from single chips to 3D ICs, whether they are interposer-based or stacked die. It’s a well-understood challenge: Die stacking can cause thermal issues because of the lack of a readily accessible thermal diss... » read more