tag: thermal simulation

Engineer’s Guide to Simulating Electronics Cooling: eBook
By Cadence - 08 Apr, 2026 - Comments: 0

Struggling with overheating PCBs, airflow bottlenecks, or long thermal simulation runtimes? As power densities rise and form factors shrink, electronics cooling is no longer a late-stage check — it’s a core design requirement. Poor thermal performance leads to hotspots, reduced reliability, field failures, and costly redesigns. Learn how to use intelligent thermal simulation to predic... » read more

Beating The Heat In 3D Packages
By Laura Peters - 25 Mar, 2026 - Comments: 0

Key Takeaways: Thermal management is a central design constraint, requiring early, thorough planning. Accurate thermal simulation requires AI-driven adaptive meshing and real-world validation. Innovative STCO strategies can drastically reduce GPU peak temperature. As HPC and AI accelerators push power densities to 1kW and beyond, the heat generated by rapidly switching tran... » read more

Thermal Simulation And Optimization in 3D-IC Design (Intel, UCSB, Cadence)
By Technical Paper Link - 22 Oct, 2025 - Comments: 0

A new technical paper titled "DeepOHeat-v1: Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design" was published by researchers at Intel Corporation, University of California, Santa Barbara and Cadence. Abstract "Thermal analysis is crucial in 3D-IC design due to increased power density and complex heat dissipation paths. Although operator ... » read more

Strategies For Reducing The Effective GaN/Diamond TBR
By Technical Paper Link - 30 Mar, 2025 - Comments: 0

A new technical paper titled "Thermal Boundary Resistance Reduction by Interfacial Nanopatterning for GaN-on-Diamond Electronics Applications" was published by researchers at University of Bristol, Cardiff University and Akash Systems. Abstract "GaN high electron mobility transistors (HEMTs) on SiC substrates are the highest performing commercially available transistors for high-power, hi... » read more

Thermal-Aware DSE Framework for 3DICs, With Advanced Cooling Models
By Technical Paper Link - 11 Mar, 2025 - Comments: 0

A new technical paper titled "Cool-3D: An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs" was published by researchers at University of Michigan, Shanghai Jiao Tong University and University of Virginia. Abstract "The rapid advancement of three-dimensional integrated circuits (3DICs) has heightened the need for early-phase design spa... » read more

Using Real Workloads To Assess Thermal Impacts
By Ann Mutschler - 14 Dec, 2023 - Comments: 0

Thermal analysis is being driven much further left in the design, fueled by demand for increased transistor density and more features on a chip or in a package, as well as the unique ways the various components may be exercised or stressed. However, getting a clear picture of the thermal activity in advanced-node chips and packages is extremely complex, and it can vary significantly by use c... » read more

LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation
By Gabriel Chang - 16 Nov, 2023 - Comments: 0

By Gabriel Chang and Ricky Zang Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) of solder joints is a widely adapted and stable process in the industry. The applications of MR include flip chip, ball mounting, surface mount technology (SMT), ... » read more

Thermal Warpage Simulation Of A Temperature-Dependent Linear Elastic Material Package
By Cadence - 08 Nov, 2023 - Comments: 0

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool enables the designer to perform early design analysis that accurately predicts warpage, thereby shortening the design process. The Cadence Celsius Thermal Solver integrated within the Cadence IC, pac... » read more

3D-IC: Operator Learning Framework For Ultra-Fast 3D Chip Thermal Prediction Under Multiple Chip Design Configurations
By Technical Paper Link - 24 Mar, 2023 - Comments: 0

A new technical paper titled "DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design" was published (preprint) by researchers at UCSB and Cadence. Abstract "Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization of 3D IC often requires massive expensive PDE simulations. Neural network-based thermal prediction models can perform ... » read more

Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO
By Nathan Whitchurch - 15 Sep, 2022 - Comments: 0

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that were once separate components on a printed circuit board (PCB) have now been relocated along with all their associated passive devices and interconnects into single System in Package (SiP) style suba... » read more

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