An electrical-thermal co-simulation technology for IC packages, PCBs, and systems.
The Celsius Thermal Solver environment enables all aspects of thermal analysis to quickly and accurately identify thermal problems in IC packages, PCBs, and electronics systems. It features an innovative massive parallel solver technology that enables simulation speeds up to 10 times faster than conventional thermal simulators, with significantly reduced memory usage. It includes a powerful finite element analysis (FEA) field solver to analyze both transient and steady-state and heat conduction in complicated solid structures and utilizes a computational fluid dynamics (CFD) engine for convection and radiation heat transfer analysis.
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