Sensor Fusion Challenges In Automotive

The number of sensors in automobiles is growing rapidly alongside new safety features and increasing levels of autonomy. The challenge is integrating them in a way that makes sense, because these sensors are optimized for different types of data, sometimes with different resolution requirements even for the same type of data, and frequently with very different latency, power consumption, and re... » read more

Quantum Well Design Basics

Key Takeaways The choice of materials for the quantum well and barrier layers is paramount. Materials must have compatible lattice structures to minimize defects, with common combinations including GaAs/AlGaAs, InGaAs/InP, and GaN/AlGaN. The width of the quantum well significantly influences the energy levels and density of states, where narrower wells result in greater separation betwe... » read more

Cadence Cerebrus In SaaS And Imagination Technologies Case Study

Artificial Intelligence (AI) has made noteworthy progress and is now ready and available for electronic design automation. The Cadence Cerebrus Intelligent Chip Explorer utilizes AI—specifically, reinforcement machine learning (ML) technology—combined with the industry-leading Cadence digital full flow to deliver better power, performance, and area (PPA) more quickly. However, this highl... » read more

3D Connection Artifacts In PDN Measurements

Authors: Ethan Koether, Amazon; Kristoffer Skytte, John Phillips, Shirin Farrahi, Cadence; Joseph Hartman, Oracle; Sammy Hindi, Ampere Computing Inc.; Mario Rotigni, STMicroelectronics; Gustavo Blando, Istvan Novak, Samtec From a simulation stand-point, we have covered several important topics that users must consider in detail to get accurate low frequency simulation results. We investigate... » read more

Expecting The Unexpected: Analyzing A Data Center Cooling Failure

Data center thermal management is often a reactive process. Servers issue warning messages, monitoring alarms activate, or employees express concern about general temperature levels/hotspots and then management decides what to do next. For incremental issues, once known, the necessary steps can be taken to resolve or improve these issues; however, what happens when a potential thermal issue onl... » read more

Machine Learning Based MBIST Area Estimation

Majority of the silicon with-in a design is occupied by memories. Memories are more prone to failures than logic due to their density. Several techniques have been established to target and detect defects within these memory instances and their interfacing logic. The most widely used approach is memory built-in self-test (MBIST) that inserts on-chip hardware unit(s) which provides systematic me... » read more

System-Driven PPA For Multi-Chiplet Designs

As we approach the device scaling limitations at advanced nodes, the demand on compute performance and data transfer for hyperscale data center and AI designs is at an all-time high. Advanced systems-on-chip (SoCs) are reaching reticle size limits, and there has been a need to find innovative solutions to continue Moore’s law scaling and achieve performance improvements with reduced power. St... » read more

How The Productivity Advantages Of High-Level Synthesis Can Improve IP Design, Verification, And Reuse

Engineering teams are under more pressure than ever before—systems on chip (SoCs) are growing more complex and design schedules are increasingly tighter. With its productivity advantages, high-level synthesis (HLS) has long been touted as part of the solution, but its sweet spot has traditionally been limited to datapath-centric blocks. Moreover, design productivity is only one part of ... » read more

An Entangled Heterarchy

For decades, a form of structural hierarchy has been the principal means of handling complexity in chip design. It's not always perfect, and there is no ideal way in which to divide and conquer because that would need to focus on the analysis being performed. In fact, most systems can be viewed from a variety of different hierarchies, equally correct, and together forming a heterarchy. The e... » read more

Why A DSP Is Indispensable In The New World of AI

Chips being designed today for the automotive, mobile handset, AI-IoT (artificial intelligence - Internet of things), and other AI applications will be fabricated in a year or two, designed into end products that will hit the market in three or more years, and then have a product lifecycle of at least five years. These chips will be used in systems with a large number and various types of senso... » read more

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