Advanced Packaging Makes Testing More Complex


The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dice are co-packaged using 2.5D and 3D approaches. But this also raises complex test challenges, which are driving new standards and approaches to advanced-package testing. While many of the showstopper issues... » read more

Week In Review: Auto, Security, Pervasive Computing


The American Foundries Act, a bipartisan initiative to revive U.S. leadership in the global microelectronics sector, was announced by U.S. Democratic Senator Chuck Schumer from New York. “The economic and national security risks posed by relying too heavily on foreign semiconductor suppliers cannot be ignored, and Upstate New York, which has a robust semiconductor sector, is the perfect place... » read more

Over-Design, Under-Design Impacts Verification


Designing a complex chip today and getting it out the door on schedule and within budget — while including all of the necessary and anticipated features and standards — is forcing engineering teams to make more tradeoffs than in the past, and those tradeoffs now are occurring throughout the flow. In an ideal system design flow, design teams will have done early, pre-design analysis to se... » read more

Rising To Meet The Thermal Challenge


Thermal effects on electrical performance have always existed; processor speed limits are set by thermal limits, and power has been a key concern for the mobile and datacenter markets for a decade. Increased electrical content logically generates more heat, which affects system performance. For example, in the automotive market, ADAS and infotainment systems are drastically increasing automotiv... » read more

Week In Review: Auto, Security, Pervasive Computing


Security Many IoT devices have some of the 19 bugs known as Ripple20 vulnerabilities. Researchers JSOF discovered the security flaws in library produces by Treck, Inc., which is used in many IoT devices. Edge, cloud, data center Rambus delivered its 112G XSR/USR PHY IP on TSMC 7nm process (N7). The SerDes PHY was designed for chiplets and co-packaged optics (CPO) architectures that are des... » read more

Week In Review: Auto, Security, Pervasive Computing


Edge, cloud, data center Programmable logic company Efinix used Cadence’s Digital Full Flow to finish Efinix’s Trion FPGA family for edge computing, AI/ML and vision processing applications, according to a press release. Last week Efinix also announced three software defined SoCs based on the RISC-V core. The SoCs are optimized to the Trion FPGAs. AI, machine learning Amazon will tempo... » read more

Best Full-Flow PPA


In the past few years, Cadence revolutionized the way digital designers could solve their design challenges by revamping the entire digital tool suite with key enhancements such as integrated engines, massively parallel processing, and early signoff optimization, all delivering faster turnaround time and best-in-class power, performance, and area (PPA) optimization. In the era of FinFETs and ad... » read more

Week In Review: Auto, Security, Pervasive Computing


Edge, cloud, data center Synopsys launched its USB4 IP and tools, already with a successful tapeout of a USB4 PHY test chip on 5nm advanced FinFET process. The Designware USB4 IP’s throughput is up to 20 or 40 Gbps, which Synopsys says is the bandwidth needed for high-performance edge AI, storage, PC, and tablet SoC designs. Also, Samsung Foundry certified Synopsys’ Design Compiler NXT for ... » read more

Computational Software


To power the technologies and products of the future, end-application system companies are increasingly designing the full stack of their solution. Some are even designing their own semiconductors, and optimizing the end-to-end solution across chips, packages, printed circuit boards (PCBs), software, and the entire system to meet demanding market requirements. This movement is driving a converg... » read more

Week In Review: Auto, Security, Pervasive Computing


An effort to fund U.S. science and technology initiatives with at least $100 billion is getting a thumbs up from the SIA (Semiconductor Industry Association). The Endless Frontier Act —  a bipartisan, bicameral bill introduced on Thursday in the U.S. House of Representatives — will invest money into semiconductor research and development and other related fields such as material science, q... » read more

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