When Verification Leads


Semiconductor Engineering sat down to discuss the implications of having an executable specification that drives verification with Hagai Arbel, CEO for VTool; Adnan Hamid, CEO for Breker Verification; Mark Olen, product marketing manager for Mentor, a Siemens Business; Jim Hogan, managing partner of Vista Ventures; Sharon Rosenberg, senior solutions architect for Cadence Design Systems; and Tom... » read more

Automotive Functional Safety Using LBIST and Other Detection Methods


Functional safety requirements for safety-critical applications are addressed with the insertion of safety mechanisms to detect and/or correct potential failures: their effectiveness is measured by diagnostic coverage (DC). Built-in-self-test, or BIST, originally developed for manufacturing test, can be used as a detection mechanism for functional safety. However, it requires original values to... » read more

Week in Review: IoT, Security, Auto


Internet of Things Apple purchased a portfolio of eight granted and pending patents that belonged to Lighthouse AI, a smart home security camera startup that ceased operations near the end of 2018. The portfolio was acquired at about the same time, according to the U.S. Patent & Trademark Office; financial terms weren’t revealed. Also not disclosed, as usual, is what Apple will do with t... » read more

Unified Compression and LBIST in a Physically Aware Environment


Unified compression is a new approach that unifies scan compression and logic built-in self-test (LBIST). It leverages recent innovations from Cadence in physically-aware design for test (DFT) to solve routing congestion and area issues from traditional discrete approaches and delivers a confident path to high-quality test. On a sample design, area savings of 35–47%, and scan wirelength savin... » read more

Week in Review: IoT, Security, Auto


Internet of Things McKinsey & Company identified 10 top trends in the Internet of Things. They include: IoT is a business opportunity, not just a tech opportunity; disciplined execution across multiple use cases is the path to value; and IoT is gradually enabling more subscription business models, but consumers are resistant. Louis Columbus of IQMS provides some IoT data points and id... » read more

The Data Deluge


Lip-Bu Tan, president and CEO of Cadence, sat down with Semiconductor Engineering to discuss the intersection of big data and technology, from the data center to the edge and vertical markets such as automotive. What follows are excerpts of that conversation. SE: What are the biggest changes you've seen over the past year? Tan: We are moving quickly toward data-driven economics. There... » read more

Consolidating RF Flow for High-Frequency Product Design


Design flows are currently fragmented due to the use of poorly connected EDA tools for various design tasks. Fragmented flows are unable to meet new challenges such as increased system and circuit complexity, stricter bandwidth requirements, smaller device sizes, and changing packaging needs. In this white paper, we look at how the Cadence Virtuoso RF Solution provides a single, well-integrated... » read more

Enabling Embedded Vision Neural Network DSPs


Neural networks are now being developed in a variety of technology segments in the embedded market, from mobile to surveillance to the automotive segment. The computational and power requirements to process this data is increasing, with new methods to approach deep learning challenges emerging every day. Vision processing systems must be designed holistically, for all platforms, with hardwa... » read more

Reducing Latency, Power, and Gate Count with Floating-Point FMA


Today’s digital signal processing applications such as radar, echo cancellation, and image processing are demanding more dynamic range and computation accuracy. Floating-point arithmetic units offer better precision, higher dynamic range, and shorter development cycles when compared with fixed-point arithmetic units. Minimizing the design’s time to market is more important than ever. Algori... » read more

A Method to Measure Die Pad Capacitance


This paper defines a method to measure the chip die pad capacitance using time delay reflectometry (TDR). This method is useful for measuring the low-value capacitance that is present at the end of a transmission line. In all protocol specifications, pad capacitance is an important electrical parameter to be measured because it directly affects the bandwidth. However, it is a challenge to me... » read more

← Older posts