Consolidating RF Flow for High-Frequency Product Design


Design flows are currently fragmented due to the use of poorly connected EDA tools for various design tasks. Fragmented flows are unable to meet new challenges such as increased system and circuit complexity, stricter bandwidth requirements, smaller device sizes, and changing packaging needs. In this white paper, we look at how the Cadence Virtuoso RF Solution provides a single, well-integrated... » read more

Enabling Embedded Vision Neural Network DSPs


Neural networks are now being developed in a variety of technology segments in the embedded market, from mobile to surveillance to the automotive segment. The computational and power requirements to process this data is increasing, with new methods to approach deep learning challenges emerging every day. Vision processing systems must be designed holistically, for all platforms, with hardwa... » read more

Reducing Latency, Power, and Gate Count with Floating-Point FMA


Today’s digital signal processing applications such as radar, echo cancellation, and image processing are demanding more dynamic range and computation accuracy. Floating-point arithmetic units offer better precision, higher dynamic range, and shorter development cycles when compared with fixed-point arithmetic units. Minimizing the design’s time to market is more important than ever. Algori... » read more

A Method to Measure Die Pad Capacitance


This paper defines a method to measure the chip die pad capacitance using time delay reflectometry (TDR). This method is useful for measuring the low-value capacitance that is present at the end of a transmission line. In all protocol specifications, pad capacitance is an important electrical parameter to be measured because it directly affects the bandwidth. However, it is a challenge to me... » read more

Week in Review: IoT, Auto, Security


Executive Changes Rambus' board of directors named Luc Seraphin, senior vice president and general manager of the company's Memory and Interfaces Division, as interim CEO while it searches for a replacement for Ron Black. The board terminated Black this week, saying the reason for termination did not involve Rambus' financial and business performance. The company also named Mike Noonen as se... » read more

The Week In Review: Manufacturing


Test and packaging In a major surprise, Cohu has entered into a definitive agreement to acquire Xcerra for approximately $796 million. With the deal, Cohu will enter the ATE market. Last year, a group from China entered into a definitive agreement under which it would acquire Xcerra. But the U.S. blocked Xcerra’s sale to the Chinese group. Ironically, at one time, Cohu was reportedly lobbyin... » read more

The Week In Review: Manufacturing


Fab tools Samsung Electronics has broken ground on a new extreme ultraviolet (EUV) lithography facility in Hwaseong, South Korea. The new EUV facility is expected to be completed within the second half of 2019 with production slated for 2020. The initial investment in the new EUV line is projected to reach $6 billion by 2020. Imec and Cadence Design Systems have collaborated on the develop... » read more

Blog Review: Nov. 29


ANSYS' Robert Harwood offers a reminder that autonomous and assisted driving technology are still very much works in progress, and flawed ones at that. It will take an estimated 5 billion to 10 billion road miles to effectively train self-driving algorithms. So far, Google has logged about 3.5 million miles. Along the same lines, Mentor's Paul Johnston takes a look at the electric car market... » read more

DARPA CHIPS Program Pushes For Chiplets


While the semiconductor industry plugs away at More Than Moore innovation, the U.S. government is guiding its own SoC development. A new program kicked off last year called ‘Common Heterogeneous Integration and IP Reuse Strategies’ or CHIPS to take its own approach the incredibly high cost of SoC design and manufacturing. DARPA said it recognizes that the explosive growth in mobile and t... » read more

The Week In Review: IoT


Finance Samsara, an Industrial Internet of Things startup, raised $40 million in its Series C financing, led by General Catalyst. Andreesen Horowitz, an existing investor, and Samsara’s founders also participated in the funding round, which values the company at $530 million. The supplier of Internet-connected sensors for industrial and transportation applications has raised a total of $80 m... » read more

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