tag: Cadence Design Systems

PCIe 6.0 Electrical Testing For High Data-Bandwidth Applications
By Cadence - 19 Jul, 2023 - Comments: 0

For nearly three decades, PCI Express® (PCIe®) technology has been the standard interconnect inside computers providing high bandwidth and low latency to meet customer demand. However, as the industry needs to evolve, so does the standard, keeping pace and driving future innovation. PCIe 6.0 is ubiquitous and offers power-efficient performance and high bandwidth for latency-sensitive appli... » read more

Celsius EC Solver
By Cadence - 24 May, 2023 - Comments: 0

The Cadence Celsius EC Solver is electronics cooling simulation software for accurate and fast analysis of the thermal performance of electronic systems. It enables electronic system designers to accurately address the most challenging thermal/electronics cooling issues today. The Celsius EC Solver utilizes a powerful computational engine and meshing technology that enables designers to model a... » read more

Automated HW/SW Co-Design Of DSP Systems Composed Of Processors And Hardware Accelerators
By Cadence - 26 Apr, 2023 - Comments: 0

Seemingly overnight, data acquisition and digital signal processing have gone from a hidden background function in special purpose-built subsystems, such as PC graphics cards and airborne missile guidance systems, to the foreground in the form of in-ear IoT devices, smartphones, and autonomous vehicles. As the number of smart data-acquisition devices grows, so does the amount of data requiring ... » read more

Managing EDA’s Rapid Growth Expectations
By Brian Bailey - 23 Mar, 2023 - Comments: 0

The EDA industry has been doing very well recently, but how long this run will continue is a matter of debate. EDA is an industry ripe for disruption due to rapid changes in chip architectures, end markets, and a long list of new technologies. In addition, recent geopolitical tensions are bringing a lot more attention to this small sector upon which the whole semiconductor industry rests. De... » read more

PCIe 6.0 Electrical Testing For High Data-Bandwidth Applications
By Cadence - 22 Mar, 2023 - Comments: 0

For nearly three decades, PCI Express (PCIe) technology has been the standard interconnect inside computers providing high bandwidth and low latency to meet customer demand. However, as the industry needs to evolve, so does the standard, keeping pace and driving future innovation. PCIe 6.0 is ubiquitous and offers power-efficient performance and high bandwidth for latency-sensitive applicati... » read more

Design IP
By Cadence - 01 Mar, 2023 - Comments: 0

Cadence is a leader in semiconductor IP addressing hyperscale computing, enterprise, data center, automotive, and artificial intelligence/machine learning (AI/ML) applications. Our IP are available in advanced-process nodes ranging from 28nm to 3nm—all silicon verified in leading-edge foundry processes. Our memory IP portfolio spans DDR, LPDDR, and GDDR. The Cadence® IP family for PCI Expres... » read more

Chiplets Taking Root As Silicon-Proven Hard IP
By Ann Mutschler - 09 Feb, 2023 - Comments: 0

Chiplets are all the rage today, and for good reason. With the various ways to design a semiconductor-based system today, IP reuse via chiplets appears to be an effective and feasible solution, and a potentially low-cost alternative to shrinking everything to the latest process node. To enable faster time to market, common IP or technology that already has been silicon-proven can be utilized... » read more

Fixed-Point And Floating-Point FMCW Radar Signal Processing With Tensilica DSPs
By Cadence - 25 Jan, 2023 - Comments: 0

Automotive Advanced Driver Assistance Systems (ADAS) applications are increasingly demanding radar modules with better capability and performance. These applications require sophisticated radar processing algorithms and powerful Digital Signal Processors (DSPs) to run them. Because these embedded systems have limited power and cost budgets, the DSP’s Instruction Set Architecture (ISA) needs t... » read more

Design And Verification Methodologies Breaking Down
By Brian Bailey - 12 Jan, 2023 - Comments: 0

Tools, methodologies and flows that have been in place since the dawn of semiconductor design are breaking down, but this time there isn't a large pool of researchers coming up with potential solutions. The industry is on its own to formulate those ideas, and that will take a lot of cooperation between EDA companies, fabs, and designers, which has not been their strong point in the past. It ... » read more

Will Floating Point 8 Solve AI/ML Overhead?
By Karen Heyman - 12 Jan, 2023 - Comments: 2

While the media buzzes about the Turing Test-busting results of ChatGPT, engineers are focused on the hardware challenges of running large language models and other deep learning networks. High on the ML punch list is how to run models more efficiently using less power, especially in critical applications like self-driving vehicles where latency becomes a matter of life or death. AI already ... » read more

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