Nathan Whitchurch

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Nathan Whitchurch is a senior staff engineer supporting packaging and mechanical simulation at Amkor. Prior to entering the electronics packaging field, Whitchurch worked on projects including vehicle-mounted computer rack enclosures, radio thermal design, datacenter thermal analysis, and systems integration. He provides system-level context and understanding to mechanical simulations at the package level. Whitchurch holds a BS degree in mechanical engineering from the University of Southern California.

Author's Latest Posts

Quantifying The Impact Of Gravity On Strip Warpage Across Assembly Stages

By Nathan Whitchurch - 19 Mar, 2026 - Comments: 0

The mechanical behavior of electronic packages is an important consideration at each stage of the assembly process. Many packages are assembled in strip format, making strip warpage a critical challenge for manufacturability and yield. Accurate simulations for strip warpage are an effective tool to determine what factors cause large warpages and to explore solutions before assembly. In these si... » read more

Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO

By Nathan Whitchurch - 15 Sep, 2022 - Comments: 0

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that were once separate components on a printed circuit board (PCB) have now been relocated along with all their associated passive devices and interconnects into single System in Package (SiP) style suba... » read more