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Speeding Up 3D Design


2.5D and 3D designs have garnered a lot of attention recently, but when should these solutions be considered and what are the dangers associated with them? Each new packaging option trades off one set of constraints and problems for a different set, and in some cases the gains may not be worth it. For other applications, they have no choice. The tooling in place today makes it possible to de... » read more

IP To Meet 2.5D Requirements


The semiconductor industry is still in the early stages of evolution in the realm of 2.5D, but when these devices do come out, the IP used on them will have to be brand new, according to Javier DeLaCruz, senior director of engineering at eSilicon. “The IP causes the biggest risk that you’re going to have in this implementation,” he said. “Everything else in here for making those ASIC... » read more