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3D-IC Design Challenges And Requirements


As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design and packaging teams are taking a close look at vertical stacking multiple chips and chiplets. This technology, called 3D-IC, promises many advantages over traditional single-die planar designs. Some are using the term “More-than-Moore” to describe the potential of this new technology. Integratio... » read more

Architecting Interposers


An interposer performs a similar function as a printed circuit board (PCB), but when the interposer is moved inside a package the impact is significant. Neither legacy PCB nor IC design tools can fully perform the necessary design and analysis tasks. But perhaps even more important, adding an interposer to a design may require organizational changes. Today, leading-edge companies have shown ... » read more

Thermal And Stress Analysis Of 3D-ICs With Celsius Thermal Solver


As electronics get smaller and faster, the environment for thermal issues is becoming more and more challenging. These problems are widespread and can appear in the chip, the board, the package, and the entire system. This white paper helps designers understand the cross-fabric thermal and stress challenges introduced by 3D-ICs and how the Cadence Celsius  Thermal Solver helps designers analyz... » read more

The Sky Isn’t Falling


By Ann Steffora Mutschler 3D ICs add a new dimension to design with new degrees of freedom possible, even with the added design and manufacturing complexities. Looking at the semiconductor ecosystem today and anticipating what will be needed to enable 3D ICs, it is certain that relationships will need to change. What will be required of the players and who will take responsibility for wh... » read more