Understand the cross-fabric thermal and stress challenges introduced by 3D-ICs.
As electronics get smaller and faster, the environment for thermal issues is becoming more and more challenging. These problems are widespread and can appear in the chip, the board, the package, and the entire system. This white paper helps designers understand the cross-fabric thermal and stress challenges introduced by 3D-ICs and how the Cadence Celsius Thermal Solver helps designers analyze the impact and develop strategies to mitigate this impact, particularly for 3D-ICs.
Click here to read more.
 |
 |
 |
 |
 |
 |
 |
 |
 |  |
Leave a Reply