Mark Bohr opens up on the company’s push into multi-chip solutions, and upcoming issues at 7nm and 5nm.

Foundry unit rolls out ambitious plan down to 4nm, along with 18nm FD-SOI and advanced packaging developments.

Demand is up, capacity is flat. A look at what’s behind this imbalance.

Technology begins to twist in different directions and for different markets.

Part 2: Heterogeneity and architectures become focus as scaling benefits shrink; IP availability may be problematic.

Chip industry repositions as technology begins to take shape; no clear winners yet.

As the market for artificial intelligence heats up, so does confusion about how to build these systems.

Technology begins to twist in different directions and for different markets.

Part 2: Heterogeneity and architectures become focus as scaling benefits shrink; IP availability may be problematic.

Andes IPO; automotive physical IP; energy processing unit; PCIe with AXI bridge; certifications and IP for TSMC 7, 12nm.

Adding more dimensions creates more data, all of which needs to be processed using new architectural approaches.

Experts at the table, part 1: What the toolchain looks like today and the different mindsets within those flows.

These devices are gaining in popularity for more critical functions as chip and system designs become more heterogeneous.