tag: thermal analysis

Deterministic, Solver-Accurate Thermal and Warpage Analysis at Manufacturing Resolution for Advanced 2.5D HBM Packages
By Vinci - 27 May, 2026 - Comments: 0

Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging. Modern packages integrate high-power ASICs with multiple High Bandwidth Memory (HBM) stacks on a silicon interposer, creating tightly coupled thermal and mechanical interactions. Die-to-die thermal crosstalk elevates HBM junction temperatures, while coefficient of thermal e... » read more

Engineer’s Guide to Simulating Electronics Cooling: eBook
By Cadence - 08 Apr, 2026 - Comments: 0

Struggling with overheating PCBs, airflow bottlenecks, or long thermal simulation runtimes? As power densities rise and form factors shrink, electronics cooling is no longer a late-stage check — it’s a core design requirement. Poor thermal performance leads to hotspots, reduced reliability, field failures, and costly redesigns. Learn how to use intelligent thermal simulation to predic... » read more

Preparing For The Multiphysics Future of 3D ICs
By Siemens EDA - 01 Apr, 2026 - Comments: 0

3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, power efficiency and cost, 3D ICs are poised to transform the landscape of electronic devices. However, with 3D ICs come new design and verification challenges that must be addressed to ensure success... » read more

Analysis of Thermal and Mechanical Behavior for Advanced Packaging (Sungkyunkwan Univ. et al)
By Technical Paper Link - 19 Dec, 2025 - Comments: 0

A new technical paper titled “A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations” was published by researchers at Sungkyunkwan University, Korea Institute of Industrial Technology, Korea University, Seoul National University, and Pukyong National University. Abstract Excerpt “... » read more

Double Intra-Cavity VCSELs: Properties And Design Challenges At Cryogenic Temperatures (Tampere Univ.)
By Technical Paper Link - 05 Aug, 2025 - Comments: 0

A new technical paper titled "Thermal characteristics of a double intra-cavity contact VCSEL for cryogenic optical links" was published by researchers at Tampere University. Excerpt "Cryogenic computing systems, including quantum computers, cryo-CMOS and superconducting processors, necessitate efficient optical data links capable of operation at temperatures as low as 4 K. Vertical-cavity s... » read more

Multi-Die Assemblies Complicate Parasitic Extraction
By Ann Mutschler - 12 Jun, 2025 - Comments: 0

The shift from planar designs to multi-die assemblies with complex interconnects is transforming what had become almost an afterthought in the design process into a first-order challenge. Parasitics include things like inductance, capacitance, and resistance, which have become more problematic at advanced nodes due to increasing logic density, thinner interconnects and insulators, and a spik... » read more

A New RF Platform For Silicon MMIC And System Design
By Cadence - 04 Jun, 2025 - Comments: 0

Next generation wireless modules combine innovative and proven RFIC/MMIC designs into a single package―delivering superior performance, lower power consumption, and reduced size, weight, and cost. Advanced system engineering plays a crucial role in this progress, with a strong focus on packaging interconnect design, RF analysis, and thermal and electromagnetic (EM) awareness that enable se... » read more

Thermal Analysis Of 3D Stacking And BEOL Technologies
By Mohamed Naeim - 10 Apr, 2025 - Comments: 0

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization (STCO) promises to mitigate technology scaling bottlenecks with system architecture tuning based on emerging technology offerings, including 3D technology. AI-driven inference accelerators continu... » read more

Thermal-Aware DSE Framework for 3DICs, With Advanced Cooling Models
By Technical Paper Link - 11 Mar, 2025 - Comments: 0

A new technical paper titled "Cool-3D: An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs" was published by researchers at University of Michigan, Shanghai Jiao Tong University and University of Virginia. Abstract "The rapid advancement of three-dimensional integrated circuits (3DICs) has heightened the need for early-phase design spa... » read more

Thermal Analysis Of 3D Stacking And BEOL Technologies With Functional Partitioning Of Many-Core RISC-V SoC
By Cadence - 26 Feb, 2025 - Comments: 0

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization (STCO) promises to mitigate technology scaling bottlenecks with system architecture tuning based on emerging technology offerings, including 3D technology. This white paper analyzes the impact of mat... » read more

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