tag: thermal analysis

The Impact Of Multiphysics On Production Electronic Design
By Marc Swinnen - 09 Sep, 2021 - Comments: 0

For many electronic design professionals, it has become clear that the industry is transitioning through an inflection point that is shifting some of the ground rules of design. The increase in the speed and integration density in today’s systems are blurring the lines between chip design and traditional board or system design. This finds its fullest expression in multi-die, 3D integrated ... » read more

Thermal Floorplanning For Chips
By Brian Bailey - 10 Jun, 2021 - Comments: 0

Heat management is becoming crucial to an increasing number of chips, and it's one of a growing number of interconnected factors that must be considered throughout the entire development flow. At the same time, design requirements are exacerbating thermal problems. Those designs either have to increase margins or become more intelligent about the way heat is generated, distributed, and dissi... » read more

Hot Or Not? An Introduction To Electrical Thermal Co-Design
By Cadence - 03 Feb, 2021 - Comments: 0

Heat transfer is not a one-way street. Traditionally, thermal analysis and management is thought of as a mechanical problem. However, modern electronic products are highly susceptible to electronic thermal issues. The electronics are often both the cause of thermal issues and the victim of overheating if temperature profiles exceed specifications. Indeed, over 50% of IC failures are related ... » read more

Thermal Impact On Reliability At 7/5nm
By Ed Sperling - 28 Sep, 2018 - Comments: 0

Haroon Chaudhri, director of RedHawk Analysis Fusion at Synopsys, talks about why thermal analysis is shifting left in the design cycle and why this is so critical at the most advanced process nodes. https://youtu.be/wjkrEFLb2vY » read more

Early Chip-Package-System Thermal Analysis
By Annapoorna Krishnaswamy - 10 May, 2018 - Comments: 0

Next-generation automotive, HPC and networking applications are pushing the requirements of thermal integrity and reliability, as they need to operate in extreme conditions for extended periods of time. FinFET designs have high dynamic power density, and power directly impacts the thermal signature of the chip. Thermal degradation typically occurs over an extended period of chip operation. ... » read more

Improving Automotive Reliability
By Annapoorna Krishnaswamy - 16 Oct, 2017 - Comments: 0

Semiconductor reliability requirements are rapidly evolving. New applications such as ADAS/self-driving cars and drones are pushing the limits for system reliability. A mobile phone that overheats in your pocket is annoying. In automobiles, it's a much different story. Overheating can impact the operation of backup sensors, which alert the driver that a pedestrian or obstacle is behind them.... » read more

7nm Power Issues And Solutions
By Preeti Gupta - 16 Nov, 2016 - Comments: 0

Being able to achieve 35% speed improvement, 65% power reduction and 3.3X higher density makes adopting a 7nm process for your next system-on-chip (SoC) design seem like an easy decision. However, with $271 million in estimated total design cost and 500 man-years it would take to bring a mid-range 7nm SoC to production, companies need to carefully weigh the benefits against the cost of designin... » read more

How Software-Driven Tests Support Concurrent Power/Performance Analysis
By Steve Carlson - 13 Oct, 2016 - Comments: 0

There’s always been an intimate relationship between performance and power—and it’s one that is acutely affected by architecture. Architectural innovation can yield orders of magnitude improvements in performance/power metrics. For example, we’ve seen a growing popularity in multi-core and heterogeneous core systems with purpose-specific hardware accelerators. These configurations are o... » read more

Calibrating Electronics Thermal Simulation Models
By Robin Bornoff - 12 Feb, 2015 - Comments: 0

‘Rubbish In, Rubbish Out’ is a common and well-accepted fact in the world of thermal simulation—actually any type of simulation, for that matter. Regardless of the technical capabilities of your thermal simulation tool, the accuracy of prediction will always be tightly coupled to the accuracy of the input data. In terms of electronics thermal simulation, the prediction of the internal ... » read more

FinFET Reliability Issues
By Arvind Vel - 13 Mar, 2014 - Comments: 0

The 16nm FinFET node has introduced several new challenges in the IC design community. In addition to the complexity of power-noise and electromigration (EM) verification, thermal reliability has become a major concern for both chip and package designers. With the three-dimensional architecture of FinFET devices, new simulation approaches are being used to model thermal behavior of the die in o... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy