Humidity resistance and reliability of different packaging structures is analyzed, including the high/low temperature and temperature cycle reliability and the thermal characteristics in different humidity environments.
Abstract
“Packaging process is an indispensable part in the process of electronic components manufacturing, and its packaging quality directly affects the nominal power, reliability and other functions of the product in the subsequent application process. Through the research on the humidity resistance reliability of different packaging structures, C-Mount packaging structure, TO packaging structure and butterfly packaging structure, three common packaging structures are introduced and analyzed first, and then studied the humidity resistance reliability of different packaging structures by analyzing the high and low temperature and temperature cycle reliability of different packaging structures and the thermal characteristics of different packaging structures in different humidity environments research. The results show that the butterfly package structure has the best humidity resistance reliability followed by TO package structure and C-Mount package structure was the worst.”
Find the technical paper here (fee). Published 10/2021.
H. Xuan, Z. Yu, H. Wu, W. Ding and G. Gao, “Research on the Humidity Resistance Reliability of Different Packaging Structures,” 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021, pp. 1-4, doi: 10.1109/ICEPT52650.2021.9567979.
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