Special Report
Manufacturing And Integration Risks
The biggest security threat is always the part over which you have no control.
Top Stories
Waiting For Next-Generation Lithography
The semiconductor industry has several possible replacements for 193nm immersion, but timing and commercial viability are still in question.
The Bumpy Road To 3D NAND
Even after the technology becomes mainstream, there are questions about how well it will scale.
The Road Ahead for 2014: Semiconductors
Not everyone is sticking on the Moore’s Law path. Experts across the industry are expecting big changes, starting this year.
Executive Viewpoint: Qualcomm On Process Technology
Geoffrey Yeap, Qualcomm’s vice president of technology, sounds off on 28nm, finFETs, Intel’s position in the foundry race, and the future of 2.5D and 3D-ICs.
Blogs
On The Mark: Fab Tool Industry Has Lost Its Way
Mark LaPedus sees executives questioning whether the fab tool industry has drifted away from innovation because it’s too worried about cost.
Piecing It Together: What’s The Backup Plan?
Disruptions in a complex global supply chain can and will happen. How prepared is the industry and what’s the backup plan?
Mentor Musings: The Trouble With Triples-Part 2
Mentor Graphics’ David Abercrombie digs into triple patterning and explains what you can do if a mask composition can’t be legally decomposed into three colors.
Riding The Silicon Rapids: Germanium wedge-FETs pry away misfit dislocations
Katherine Derbyshire examines selective etching and why it can create high-quality germanium pillars for FinFETs.
Semico Spin: Beyond The CES Hype
Semico Research’s Joanne Itow takes a step back from the sensory overload of CES to assess what’s real, what’s flash, and how that will play out in the future.
ImPatterning: Printed Electronics Gets Serious About Manufacturing
Patterning expert Michael Watts checks out the new applications showing promise at a recent show—and who was a no-show on the guest list.
